Recommendation on PCB assembly

HSP051-4M10

8/12

DocID024952 Rev 4

3

Recommendation on PCB assembly

Figure 20. Recommended stencil window position

3.1

Solder paste

1.

Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004.

2.

“No clean” solder paste recommended.

3.

Offers a high tack force to resist component displacement during PCB movement.

4.

Use solder paste with fine particles: powder particle size 20-45 µm.

3.2

Placement

1.

Manual positioning is not recommended.

2.

It is recommended to use the lead recognition capabilities of the placement system, not

the outline centering.

3.

Standard tolerance of ± 0.05 mm is recommended.

4.

3.5 N placement force is recommended. Too much placement force can lead to

squeezed out solder paste and cause solder joints to short. Too low placement force

0.55

1.37

0.19

0.38

2.19

0.50

0.55

0.27

All dimensions are in mm

Stencil thisckness 100 µm