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ESD9L5.0ST5G Datasheet(PDF) 1 Page - ON Semiconductor |
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ESD9L5.0ST5G Datasheet(HTML) 1 Page - ON Semiconductor |
1 / 4 page © Semiconductor Components Industries, LLC, 2017 January, 2017 − Rev. 6 1 Publication Order Number: ESD9L/D ESD9L, SESD9L Series Transient Voltage Suppressors ESD Protection Diodes with Ultra−Low Capacitance The ESD9L Series is designed to protect voltage sensitive components that require ultra−low capacitance from ESD and transient voltage events. Excellent clamping capability, low capacitance, low leakage, and fast response time, make these parts ideal for ESD protection on designs where board space is at a premium. Because of its low capacitance, it is suited for use in high frequency designs such as USB 2.0 high speed and antenna line applications. Specification Features: • Ultra Low Capacitance 0.5 pF • Low Clamping Voltage • Small Body Outline Dimensions: 0.039 ″ x 0.024″ (1.00 mm x 0.60 mm) • Low Body Height: 0.016″ (0.4 mm) • Stand−off Voltage: 3.3 V, 5 V • Low Leakage • Response Time is Typically < 1.0 ns • IEC61000−4−2 Level 4 ESD Protection • S and SZ Prefixes for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable • These Devices are Pb−Free and are RoHS Compliant Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic Epoxy Meets UL 94 V−0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any QUALIFIED MAX REFLOW TEMPERATURE: 260 °C Device Meets MSL 1 Requirements MAXIMUM RATINGS Rating Symbol Value Unit IEC 61000−4−2 (ESD) Contact Air ±10 ±15 kV Total Power Dissipation on FR−5 Board (Note 1) @ TA = 25°C °PD° 150 mW Storage Temperature Range Tstg −55 to +150 °C Junction Temperature Range TJ −55 to +150 °C Lead Solder Temperature − Maximum (10 Second Duration) TL 260 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. FR−5 = 1.0 x 0.75 x 0.62 in. See Application Note AND8308/D for further description of survivability specs. Device Package Shipping† ORDERING INFORMATION SOD−923 CASE 514AB ESD9LxxxST5G SOD−923 (Pb−Free) 8000/Tape & Reel MARKING DIAGRAM See specific marking information in the device marking column of the Electrical Characteristics tables starting on page 2 of this data sheet. DEVICE MARKING INFORMATION †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. X = Specific Device Code M = Date Code www.onsemi.com X M *Date Code orientation and/or position may vary depending upon manufacturing location. PIN 1. CATHODE 2. ANODE 12 12 1 2 SESD9LxxxST5G SOD−923 (Pb−Free) 8000/Tape & Reel SZESD9LxxxST5G SOD−923 (Pb−Free) 8000/Tape & Reel |
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