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BGA6589 Datasheet(PDF) 3 Page - NXP Semiconductors |
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BGA6589 Datasheet(HTML) 3 Page - NXP Semiconductors |
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3 / 12 page  2003 Sep 19 3 Philips Semiconductors Product specification MMIC wideband medium power amplifier BGA6589 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134) Note 1. Ts is the temperature at the soldering point of pin 2. THERMAL CHARACTERISTICS Note 1. Ts is the temperature at the soldering point of pin 2. STATIC CHARACTERISTICS Tj =25 °C; VS =9V; Rbias =51 Ω; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VS DC device voltage RF input AC coupled − 6V IS DC supply current − 150 mA Ptot total power dissipation Ts ≤ 70 °C; note 1 − 800 mW Tstg storage temperature −65 +150 °C Tj operating junction temperature − 150 °C PD maximum drive power − 15 dBm SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-s thermal resistance from junction to solder point Ts ≤ 70 °C note 1 100 K/W SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT IS supply current 73 81 89 mA |
Similar Part No. - BGA6589 |
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Similar Description - BGA6589 |
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