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K4R881869D Datasheet(PDF) 4 Page - Samsung semiconductor |
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K4R881869D Datasheet(HTML) 4 Page - Samsung semiconductor |
4 / 20 page Direct RDRAM™ K4R571669D/K4R881869D Page 2 Version 1.4 July 2002 COL ROW Pinouts and Definitions Center-Bonded Devices These tables shows the pin assignments of the center-bonded RDRAM package. The mechanical dimensions of this package are shown in a later section. Refer to Section “Center-Bonded WBGA Package” on page 18. Note - pin #1 is at the A1 position. Table 1: Center-Bonded Device (top view) 10 VDD GND VDD GND VDD VDD VDD VDD GND VDD 9 8 GND VDD CMD VDD GND GNDa GNDa VDD VDD GND GND VDD VDD GND GND VCMOS VDD GND 7 VDD DQA8 DQA7 DQA5 DQA3 DQA1 CTMN CTM RQ7 RQ5 RQ3 RQ1 DQB1 DQB3 DQB5 DQB7 DQB8 VDD 6 5 4 GND GND DQA6 DQA4 DQA2 DQA0 CFM CFMN RQ6 RQ4 RQ2 RQ0 DQB0 DQB2 DQB4 DQB6 GND GND 3 VDD GND SCK VCMOS GND VDD GND VDDa VREF GND VDD GND GND VDD SIO0 SIO1 GND VDD 2 1 VDD GND GND VDD GND GND GND GND GND VDD A B C D E F G H J K L M N P R S T U Chip Top View The pin #1(ROW 1, COL A) is located at the A1 position on the top side and the A1 position is marked by the marker “ ” . K4RXXXX69D-Fxxx SAMSUNG 230 |
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