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VC1206L601R004 Datasheet(PDF) 8 Page - Kemet Corporation

Part # VC1206L601R004
Description  Surface Mount Varistors
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Manufacturer  KEMET [Kemet Corporation]
Direct Link  http://www.kemet.com
Logo KEMET - Kemet Corporation

VC1206L601R004 Datasheet(HTML) 8 Page - Kemet Corporation

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© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
V0002_VC • 10/26/2016
Surface Mount Varistors
VC Series Low Voltage 125°C
Soldering
PopularsolderingtechniquesusedforsurfacemountedcomponentsareWaveandInfraredReflowprocesses.Bothprocessescanbe
performed with Pb-containing or Pb-free solders. The termination option available for these soldering techniques is Barrier Type End
Terminations.
End Termination
Designation
Recommended and
Suitable for
Component RoHS
Compliant
Ni Sn Barrier Type End
Termination
Ni R1
Pb-containing and
Pb-free soldering
Yes
Wave Soldering – this process is generally associated with discrete components mounted on the underside of printed circuit boards, or
for large top-side components with bottom-side mounting tabs to be attached, such as the frames of transformers, relays, connectors,
etc.SMDvaristorstobewavesolderedarefirstgluedtothecircuitboard,usuallywithanepoxyadhesive.Whenallcomponentsonthe
PCB have been positioned and an appropriate time is allowed for adhesive curing, the completed assembly is then placed on a conveyor
and run through a single, double wave process.
Infrared Reflow Soldering–thesereflowprocessesaretypicallyassociatedwithtop-sidecomponentplacement.Thistechniqueutilizes
amixtureofadhesiveandsoldercompounds(andsometimesfluxes)thatareblendedintoapaste.ThepasteisthenscreenedontoPCB
solderingpadsspecificallydesignedtoacceptaparticularsizedSMDcomponent.Therecommendedsolderpastewetlayerthickness
is100to300µm.OncethecircuitboardisfullypopulatedwithMDcomponents,itisplacedinareflowenvironment,wherethepasteis
heatedtoslightlyaboveitseutectictemperature.Whenthesolderpastereflows,theSMDcomponentsareattachedtothesolderpads.
Solder Fluxes–solderfluxesaregenerallyappliedtopopulatedcircuitboardstocleanoxidesformingduringtheheatingprocessandto
facilitatetheflowingofthesolder.Solderfluxescanbeeitherapartofthesolderpastecompoundorcanbeseparatematerials,usually
fluids.Recommendedfluxesare:
•non-activated(R)fluxes,wheneverpossible
•mildlyactivated(RMA)fluxesofclassL3CN
• class ORLO
Activated (RA),watersolubleorstrongacidicfluxeswithachlorinecontent>0.2wt.%areNOTRECOMMENDED.Theuseofsuchfluxes
could create high leakage current paths along the body of the varistor components.
Whenafluxisappliedpriortowavesoldering,itisimportanttocompletelydryanyresidualfluxsolventspriortothesolderingprocess.
Thermal Shock – to avoid the possibility of generating stresses in the varistor chip due to thermal shock, a preheat stage to within 100
°Cofthepeaksolderingprocesstemperatureisrecommended.Additionally,SMDvaristorsshouldnotbesubjectedtoatemperature
gradientgreaterthan4°C/sec.,withanidealgradientbeing2°C/sec.Peaktemperaturesshouldbecontrolled.WaveandReflow
solderingconditionsforSMDvaristorswithPb-containingsoldersareshowninFig.1and2respectively,whileWaveandReflowsoldering
conditions for SMD varistors with Pb-free solders are shown in Fig, 1 and 3


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