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T510X477M020ZHE800 Datasheet(PDF) 8 Page - Kemet Corporation |
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T510X477M020ZHE800 Datasheet(HTML) 8 Page - Kemet Corporation |
8 / 15 page © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com T2014_T510 • 9/21/2016 88 Tantalum Surface Mount Capacitors – Low ESR T510 Series Multiple Anode MnO 2 Soldering Process KEMET’sfamiliesofsurfacemountcapacitorsare compatiblewithwave(singleordual),convection,IR, orvaporphasereflowtechniques.Preheatingofthese components is recommended to avoid extreme thermal stress.KEMET'srecommendedprofileconditionsfor convectionandIRreflowreflecttheprofileconditionsofthe IPC/J–STD–020D standard for moisture sensitivity testing. Thedevicescansafelywithstandamaximumofthreereflow passes at these conditions. Please note that although the X/7343–43 case size can withstandwavesoldering,thetallprofile(4.3mmmaximum) dictates care in wave process development. Hand soldering should be performed with care due to the difficultyinprocesscontrol.Ifperformed,careshouldbe taken to avoid contact of the soldering iron to the molded case. The iron should be used to heat the solder pad, applying solder between the pad and the termination, until reflowoccurs.Oncereflowoccurs,theironshouldbe removed immediately. “Wiping” the edges of a chip and heating the top surface is not recommended. Duringtypicalreflowoperations,aslightdarkeningofthe gold-colored epoxy may be observed. This slight darkening is normal and not harmful to the product. Marking permanency is not affected by this change. Profile Feature SnPb Assembly Pb-Free Assembly Preheat/Soak TemperatureMinimum(T Smin) 100°C 150°C TemperatureMaximum(T Smax) 150°C 200°C Time(t s)fromTsmin to Tsmax) 60 – 120 seconds 60 – 120 seconds Ramp-upRate(T L to TP) 3°C/secondsmaximum 3°C/secondsmaximum LiquidousTemperature(T L) 183°C 217°C TimeAboveLiquidous(t L) 60 – 150 seconds 60 – 150 seconds PeakTemperature(T P) 220°C* 235°C** 250°C* 260°C** Timewithin5°CofMaximum PeakTemperature(t P) 20 seconds maximum 30 seconds maximum Ramp-downRate(T P to TL) 6°C/secondsmaximum 6°C/secondsmaximum Time25°CtoPeak Temperature 6 minutes maximum 8 minutes maximum Note: All temperatures refer to the center of the package, measured on the package body surface that is facing up during assembly reflow. *Case Size D, E, P, Y, and X **Case Size A, B, C, H, I, K, M, R, S, T, U, V, W, and Z Storage Tantalum chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp andtapepeelforcemayincrease.KEMETrecommendsthatmaximumstoragetemperaturenotexceed40ºCandmaximum storagehumiditynotexceed60%relativehumidity.Temperaturefluctuationsshouldbeminimizedtoavoidcondensation onthepartsandatmospheresshouldbefreeofchlorineandsulphurbearingcompounds.Foroptimizedsolderabilitychip stock should be used promptly, preferably within three years of receipt. Time T smin 25 T smax T L T P Maximum Ramp Up Rate = 3ºC/sec Maximum Ramp Down Rate = 6ºC/sec t P t L t s 25ºC to Peak |
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