ESD7008, SZESD7008

www.onsemi.com

10

PACKAGE DIMENSIONS

UDFN18, 5.5x1.5, 0.5P

CASE 517BV

ISSUE A

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.10 AND 0.20 MM FROM TERMINAL TIP.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

5. EXPOSED ENDS OF TERMINALS ARE

ELECTRICALLY ACTIVE.

DIM

MIN

MAX

MILLIMETERS

A

0.45

0.55

A1

0.00

0.05

A3

0.13 REF

b

0.15

0.25

D

5.50 BSC

D2

0.45

0.55

E

1.50 BSC

eA

0.50 BSC

L

0.20

0.40

0.10 C

D

E

B

A

2X

2X

NOTE 4

A

A1

(A3)

0.10 C

PIN ONE

REFERENCE

0.10 C

0.05 C

C

SEATING

PLANE

BOTTOM VIEW

b

eB

18X

0.10

B

0.05

A

C

C

L

SIDE VIEW

TOP VIEW

NOTE 3

1

11

12

18

3X

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

DETAIL A

L1

0.00

0.05

DIMENSION: MILLIMETERS

RECOMMENDED

L1

DETAIL A

L

OPTIONAL

CONSTRUCTIONS

DETAIL B

MOLD CMPD

EXPOSED Cu

OPTIONAL

CONSTRUCTION

DETAIL B

0.50

1.80

0.60

0.50

PITCH

eB

0.75 BSC

3X

0.30

18X

E2

0.35

0.45

eA

M

M

D2

E2

NOTE 5

END VIEW

0.75

PITCH

1.50

PITCH

18X

0.50

L

L2

L2

0.10 REF

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