ESD7371 datasheet(1/8 Pages) ONSEMI

Part #	ESD7371

Description	Ultra-Low Capacitance ESD Protection

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Manufacturer	ONSEMI [ON Semiconductor]

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September, 2014 − Rev. 1

1

Publication Order Number:

ESD7371/D

ESD7371,

SZESD7371 Series

Ultra-Low Capacitance ESD

Protection

The ESD7371 Series is designed to protect voltage sensitive

components that require ultra−low capacitance from ESD and

transient voltage events. Excellent clamping capability, low

capacitance, high breakdown voltage, high linearity, low leakage, and

fast response time make these parts ideal for ESD protection on

designs where board space is at a premium. It has industry leading

capacitance linearity over voltage making it ideal for RF applications.

This capacitance linearity combined with the extremely small package

and low insertion loss makes this part well suited for use in antenna

line applications for wireless handsets and terminals.

Features

• Industry Leading Capacitance Linearity Over Voltage

• Low Capacitance (0.7 pF Max, I/O to GND)

• Stand−off Voltage: 5.3 V

• Low Leakage: < 1 nA

• Low Dynamic Resistance < 1 W

• IEC61000−4−2 Level 4 ESD Protection

• 1000 ESD IEC61000−4−2 Strikes ±8 kV Contact / Air Discharged

• SZ Prefix for Automotive and Other Applications Requiring Unique

Site and Control Change Requirements; AEC−Q101 Qualified and

PPAP Capable

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

Typical Applications

• RF Signal ESD Protection

• RF Switching, PA, and Antenna ESD Protection

• Near Field Communications

• USB 2.0, USB 3.0

MAXIMUM RATINGS (TA = 25°C unless otherwise noted)

Rating

Symbol

Value

Unit

IEC 61000−4−2 (ESD) (Note 1)

20

kV

IEC 61000−4−5 (ESD) (Note 2)

3.0

A

Total Power Dissipation (Note 3) @ TA = 25°C

Thermal Resistance, Junction−to−Ambient

°PD°

RqJA

300

400

mW

°C/W

Junction and Storage Temperature Range

TJ, Tstg

−55 to

+150

°C

Lead Solder Temperature − Maximum

(10 Second Duration)

TL

260

°C

Stresses exceeding those listed in the Maximum Ratings table may damage the

device. If any of these limits are exceeded, device functionality should not be

assumed, damage may occur and reliability may be affected.

1. Non−repetitive current pulse at TA = 25°C, per IEC61000−4−2 waveform.

2. Non−repetitive current pulse at TA = 25°C, per IEC61000−4−5 waveform.

3. Mounted with recommended minimum pad size, DC board FR−4

See Application Note AND8308/D for further description of survivability specs.

MARKING

DIAGRAMS

PIN CONFIGURATION

AND SCHEMATIC

http://onsemi.com

X, XX

= Specific Device Code

M

= Date Code

1

Cathode

2

Anode

SOD−323

CASE 477

SOD−523

CASE 502

SOD−923

CASE 514AB

1

2

AG

M

1

2

AG

12

AE M

See detailed ordering and shipping information in the package

dimensions section on page 5 of this data sheet.

ORDERING INFORMATION

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