ESD7382MUT5G

www.onsemi.com

6

PACKAGE DIMENSIONS

X2DFN2 1.0x0.6, 0.65P

CASE 714AB

ISSUE O

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. EXPOSED COPPER ALLOWED AS SHOWN.

A B

E

D

BOTTOM VIEW

b

L

0.10 C

TOP VIEW

0.05 C

A

A1

0.10 C

0.10 C

C

SEATING

PLANE

SIDE VIEW

DIM

MIN

MAX

MILLIMETERS

A

0.34

0.40

A1

−−−

0.05

b

0.45

0.55

D

1.00 BSC

E

0.60 BSC

SOLDER FOOTPRINT*

DIMENSIONS: MILLIMETERS

1.20

0.60

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

1

L

0.20

0.30

0.47

RECOMMENDED

PIN 1

PIN 1

INDICATOR

e

0.65 BSC

A

M

0.05

B

C

A

M

0.05

B

C

2X

e

e/2

2X

2X

NOTE 3

PUBLICATION ORDERING INFORMATION

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5817−1050

ESD7382/D

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