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T496X227M025AHE500 Datasheet(PDF) 11 Page - Kemet Corporation |
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T496X227M025AHE500 Datasheet(HTML) 11 Page - Kemet Corporation |
11 / 18 page © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com T2010_T496 • 9/22/2016 11 11 Tantalum Surface Mount Capacitors – Fused T496 Series Fused MnO 2 Soldering Process KEMET’sfamiliesofsurfacemountcapacitorsarecompatible withwave(singleordual),convection,IR,orvaporphase reflowtechniques.Preheatingofthesecomponentsis recommended to avoid extreme thermal stress. KEMET's recommendedprofileconditionsforconvectionandIR reflowreflecttheprofileconditionsoftheIPC/J–STD–020D standard for moisture sensitivity testing. The devices can safelywithstandamaximumofthreereflowpassesatthese conditions. PleasenotethatalthoughtheX/7343–43casesizecan withstandwavesoldering,thetallprofile(4.3mmmaximum) dictates care in wave process development. Hand soldering should be performed with care due to the difficultyinprocesscontrol.Ifperformed,careshouldbe taken to avoid contact of the soldering iron to the molded case. The iron should be used to heat the solder pad, applying solderbetweenthepadandthetermination,untilreflow occurs.Oncereflowoccurs,theironshouldberemoved immediately. “Wiping” the edges of a chip and heating the top surface is not recommended. Duringtypicalreflowoperations,aslightdarkeningofthe gold-colored epoxy may be observed. This slight darkening is normal and not harmful to the product. Marking permanency is not affected by this change. Profile Feature SnPb Assembly Pb-Free Assembly Preheat/Soak TemperatureMinimum(T Smin) 100°C 150°C TemperatureMaximum(T Smax) 150°C 200°C Time(t s)fromTsmin to Tsmax) 60 – 120 seconds 60 – 120 seconds Ramp-upRate(T L to TP) 3°C/secondsmaximum 3°C/secondsmaximum LiquidousTemperature(T L) 183°C 217°C TimeAboveLiquidous(t L) 60 – 150 seconds 60 – 150 seconds PeakTemperature(T P) 220°C* 235°C** 250°C* 260°C** Timewithin5°CofMaximum PeakTemperature(t P) 20 seconds maximum 30 seconds maximum Ramp-downRate(T P to TL) 6°C/secondsmaximum 6°C/secondsmaximum Time25°CtoPeak Temperature 6 minutes maximum 8 minutes maximum Note: All temperatures refer to the center of the package, measured on the package body surface that is facing up during assembly reflow. *Case Size D, E, P, Y, and X **Case Size A, B, C, H, I, K, M, R, S, T, U, V, W, and Z Storage Tantalum chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp andtapepeelforcemayincrease.KEMETrecommendsthatmaximumstoragetemperaturenotexceed40°Candmaximum storagehumiditynotexceed60%relativehumidity.Temperaturefluctuationsshouldbeminimizedtoavoidcondensationon thepartsandatmospheresshouldbefreeofchlorineandsulphurbearingcompounds.Foroptimizedsolderabilitychipstock should be used promptly, preferably within three years of receipt. Time T smin 25 T smax T L T P Maximum Ramp Up Rate = 3ºC/sec Maximum Ramp Down Rate = 6ºC/sec t P t L t s 25ºC to Peak |
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