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F844FH104M440C Datasheet(PDF) 7 Page - Kemet Corporation |
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F844FH104M440C Datasheet(HTML) 7 Page - Kemet Corporation |
7 / 14 page © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com F3108_PHE844_X1_440-480 • 5/15/2015 7 Film Capacitors – Metallized Polypropylene Film EMI Suppression Capacitors PHE844 Series, Class X1, 440/480 VAC, 105°C Manual Soldering Recommendations Following is the recommendation for manual soldering with a soldering iron. Thesolderingirontiptemperatureshouldbeset at350°C(+10°Cmaximum)withthesoldering duration not to exceed more than 3 seconds. Recommended Soldering Temperature 0 50 100 150 200 250 300 350 400 0 1 2 3 4 5 6 7 8 Soldering time (sec) Soldering Process The implementation of the RoHS directive has resulted in the selection of SnAgCu (SAC) alloys or SnCu alloys as primary solder. This has increasedtheliquidustemperaturefromthatof183ºCforSnPbeutecticalloyto217–221ºCforthenewalloys.Asaresult,theheatstress tothecomponents,eveninwavesoldering,hasincreasedconsiderablyduetohigherpre-heatandwavetemperatures.Polypropylene capacitorsareespeciallysensitivetoheat(themeltingpointofpolypropyleneis160–170ºC).Wavesolderingcanbedestructive,especially formechanicallysmallpolypropylenecapacitors(withleadspacingof5mmto15mm),andgreatcarehastobetakenduringsoldering.The recommendedsolderprofilesfromKEMETshouldbeused.PleaseconsultKEMETwithanyquestions.Ingeneral,thewavesolderingcurve fromIECPublication61760-1Edition2servesasasolidguidelineforsuccessfulsoldering.PleaseseeFigure1. Reflowsolderingisnotrecommendedforthrough-holefilmcapacitors.Exposingcapacitorstoasolderingprofileinexcessoftheabovethe recommended limits may result to degradation or permanent damage to the capacitors. Do not place the polypropylene capacitor through an adhesive curing oven to cure resin for surface mount components. Insert through- holepartsafterthecuringofsurfacemountparts.ConsultKEMETtodiscusstheactualtemperatureprofileintheoven,ifthrough-hole components must pass through the adhesive curing process. A maximum two soldering cycles is recommended. Please allow time for the capacitorsurfacetemperaturetoreturntoanormaltemperaturebeforethesecondsolderingcycle. Wave Soldering Recommendations 0 50 100 150 200 250 300 0 40 80 120 160 200 240 Time (s) ca 2°C/s ca 3.5°C/s typical ca 5°C/s Cooling 2+3s max 115°C max Tpreheat ΔT <150°C 100°C Preheating Typical First wave Second wave 260°C |
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