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PHE845VF5100KR06L2 Datasheet(PDF) 7 Page - Kemet Corporation

Part # PHE845VF5100KR06L2
Description  Metallized Polypropylene Film EMI Suppression Capacitors
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Manufacturer  KEMET [Kemet Corporation]
Direct Link  http://www.kemet.com
Logo KEMET - Kemet Corporation

PHE845VF5100KR06L2 Datasheet(HTML) 7 Page - Kemet Corporation

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© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
F3109_PHE845_X1_760 • 5/15/2015
7
Film Capacitors – Metallized Polypropylene Film EMI Suppression Capacitors
PHE845 Series, Class X1, 760 VAC, 105°C
Manual Soldering Recommendations
Following is the recommendation for manual
soldering with a soldering iron.
Thesolderingirontiptemperatureshouldbeset
at350°C(+10°Cmaximum)withthesoldering
duration not to exceed more than 3 seconds.
Recommended Soldering Temperature
0
50
100
150
200
250
300
350
400
0
1
2
3
4
5
6
7
8
Soldering time (sec)
Soldering Process
The implementation of the RoHS directive has resulted in the selection of SnAgCu (SAC) alloys or SnCu alloys as primary solder. This has
increasedtheliquidustemperaturefromthatof183ºCforSnPbeutecticalloyto217–221ºCforthenewalloys.Asaresult,theheatstress
tothecomponents,eveninwavesoldering,hasincreasedconsiderablyduetohigherpre-heatandwavetemperatures.Polypropylene
capacitorsareespeciallysensitivetoheat(themeltingpointofpolypropyleneis160–170ºC).Wavesolderingcanbedestructive,especially
formechanicallysmallpolypropylenecapacitors(withleadspacingof5mmto15mm),andgreatcarehastobetakenduringsoldering.The
recommendedsolderprofilesfromKEMETshouldbeused.PleaseconsultKEMETwithanyquestions.Ingeneral,thewavesolderingcurve
fromIECPublication61760-1Edition2servesasasolidguidelineforsuccessfulsoldering.PleaseseeFigure1.
Reflowsolderingisnotrecommendedforthrough-holefilmcapacitors.Exposingcapacitorstoasolderingprofileinexcessoftheabovethe
recommended limits may result to degradation or permanent damage to the capacitors.
Do not place the polypropylene capacitor through an adhesive curing oven to cure resin for surface mount components. Insert through-
holepartsafterthecuringofsurfacemountparts.ConsultKEMETtodiscusstheactualtemperatureprofileintheoven,ifthrough-hole
components must pass through the adhesive curing process. A maximum two soldering cycles is recommended. Please allow time for the
capacitorsurfacetemperaturetoreturntoanormaltemperaturebeforethesecondsolderingcycle.
Wave Soldering Recommendations
0
50
100
150
200
250
300
0
40
80
120
160
200
240
Time (s)
ca 2°C/s
ca 3.5°C/s typical
ca 5°C/s
Cooling
2+3s max
115°C max
Tpreheat
ΔT <150°C
100°C
Preheating
Typical
First wave
Second wave
260°C


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