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CC3220MOD Datasheet(PDF) 7 Page - Texas Instruments |
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CC3220MOD Datasheet(HTML) 7 Page - Texas Instruments |
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7 / 88 page  7 CC3220MOD www.ti.com SWRS206A – MARCH 2017 – REVISED JUNE 2017 Submit Documentation Feedback Product Folder Links: CC3220MOD Table of Contents Copyright © 2017, Texas Instruments Incorporated Table of Contents 1 Module Overview ........................................ 1 1.1 Features .............................................. 1 1.2 Applications ........................................... 2 1.3 Description ............................................ 2 1.4 Functional Block Diagrams ........................... 4 2 Revision History ......................................... 8 3 Device Comparison ..................................... 9 3.1 Related Products .................................... 10 4 Terminal Configuration and Functions ............ 11 4.1 CC3220MODx Pin Diagram ......................... 11 4.2 Pin Attributes ........................................ 12 4.3 Connections for Unused Pins ....................... 13 4.4 Pin Attributes and Pin Multiplexing .................. 14 4.5 Drive Strength and Reset States for Analog-Digital Multiplexed Pins ..................................... 28 4.6 Pad State After Application of Power To Chip, But Before Reset Release ............................... 29 5 Specifications ........................................... 30 5.1 Absolute Maximum Ratings ......................... 30 5.2 ESD Ratings ........................................ 30 5.3 Recommended Operating Conditions ............... 30 5.4 Current Consumption (CC3220MODS) ............. 31 5.5 Current Consumption (CC3220MODSF) ............ 32 5.6 TX Power and IBAT Versus TX Power Level Settings .............................................. 33 5.7 Brownout and Blackout Conditions ................. 35 5.8 Electrical Characteristics ............................ 36 5.9 WLAN Receiver Characteristics .................... 38 5.10 WLAN Transmitter Characteristics .................. 38 5.11 Reset Requirement ................................. 38 5.12 Thermal Resistance Characteristics for MOB Package ............................................. 39 5.13 Timing and Switching Characteristics ............... 39 6 Detailed Description ................................... 51 6.1 Overview ............................................ 51 6.2 ARM® Cortex®-M4 Processor Core Subsystem .... 51 6.3 Wi-Fi Network Processor Subsystem ............... 51 6.4 Security .............................................. 54 6.5 Power-Management Subsystem .................... 57 6.6 Low-Power Operating Mode ........................ 57 6.7 Memory .............................................. 58 6.8 Restoring Factory Default Configuration ............ 61 6.9 Boot Modes .......................................... 62 6.10 Device Certification and Qualification ............... 63 6.11 Module Markings .................................... 65 6.12 End Product Labeling ............................... 66 6.13 Manual Information to the End User ................ 66 7 Applications, Implementation, and Layout ....... 67 7.1 Typical Application .................................. 67 7.2 Device Connection and Layout Fundamentals ...... 69 7.3 PCB Layout Guidelines ............................. 69 8 Environmental Requirements and Specifications ........................................... 75 8.1 Temperature ......................................... 75 8.2 Handling Environment .............................. 75 8.3 Storage Condition ................................... 75 8.4 Baking Conditions ................................... 75 8.5 Soldering and Reflow Condition .................... 75 9 Device and Documentation Support ............... 77 9.1 Device Nomenclature ............................... 77 9.2 Development Tools and Software ................... 77 9.3 Firmware Updates ................................... 77 9.4 Documentation Support ............................. 78 9.5 Trademarks .......................................... 80 9.6 Electrostatic Discharge Caution ..................... 80 9.7 Export Control Notice ............................... 80 9.8 Glossary ............................................. 80 10 Mechanical, Packaging, and Orderable Information .............................................. 81 10.1 Mechanical, Land, and Solder Paste Drawings ..... 81 10.2 Package Option Addendum ......................... 82 10.3 Tape and Reel Information .......................... 83 |
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