5

bq294502, bq294504, bq294512, bq294514

bq294515, bq294522, bq294524, bq294532

bq294533, bq294562, bq294572, bq294582, bq294592

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SLUSAJ3F – SEPTEMBER 2011 – REVISED JUNE 2017

Product Folder Links: bq294502 bq294504 bq294512 bq294514 bq294515 bq294522 bq294524 bq294532

bq294533 bq294562 bq294572 bq294582 bq294592

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Copyright © 2011–2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

See Figure 8.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Supply voltage

VDD–VSS

–0.3

30

V

Input voltage

V1–VSS or V2–VSS or V3–VSS+

–0.3

30

V

V3–V2 or V2–V1

–0.3

8

V

Output voltage

OUT–VSS

–0.3

30

V

See Thermal

Information

300

°C

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

±500

(1)

See Typical Application.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

(1)

3

25

V

Input voltage

V3–V2 or V2–V1 or V1–VSS

0

5

V

–40

110

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

bq2945xx

UNIT

DRV (SON)

6 PINS

Junction-to-ambient thermal resistance

186.4

°C/W

Junction-to-case(top) thermal resistance

90.4

°C/W

Junction-to-board thermal resistance

110.7

°C/W

Junction-to-top characterization parameter

96.7

°C/W

Junction-to-board characterization parameter

90

°C/W

Junction-to-case(bottom) thermal resistance

N/A

°C/W