© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com

F3087_P278_X1_480 • 10/10/2014

9

Film Capacitors

AC Line EMI Suppression and RC Networks – P278 Series Metallized Impregnated Paper, Class X1, 480 VAC

Lead Taping & Packaging (IEC 60286–2)

Taping Specification

Dimensions in mm

Standard IEC 60286–2

Lead spacing

+6/-0.1

F

Formed

7.5

10.2

15.2

20.3

22.5

F

Carrier tape width

+/-0.5

W

18

18

18

18

18

Hold-down tape width

+/-0.3

W

0

9

12

12

12

12

Position of sprocket hole

+/-0.5

W

1

9

9

9

9

9

Distance between tapes

Maximum

W

2

3

3

3

3

3

3

Sprocket hole diameter

+/-0.2

D

0

4

4

4

4

4

4

Feed hole lead spacing

+/-0.3

P

0

(1)

12.7

12.7

12.7

12.7

12.7

Distance lead – feed hole

+/-0.7

P

1

3.75

7.6

5.1

8.9

5.3

Deviation tape – plane

Maximum

∆p

1.3

1.3

1.3

1.3

1.3

1.3

Lateral deviation

Maximum

∆h

2

2

2

2

2

2

Total thickness

+/-0.2

t

0.7

0.7

0.7

0.7

Sprocket hole/cap body

Nominal

H

0

(2)

Sprocket hole/top of cap body

Maximum

H

1

(3)

35

35

35

35

58

(1) Maximum cumulative feed hole error, 1 mm per 20 parts.

(2) 16.5 mm available on request.

(3) Depending on case size.

(4) 15 mm available on request.

Lead Spacing 10.2 – 15.2 mm

Lead Spacing 20.3 – 22.5 mm

Formed Leads from 10.2 to 7.5 mm

0

0

0