© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com

C1035_C0G_PULSE_SMD • 8/2/2016

8

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Pulse Discharge, High Voltage, High Temperature 200°C C0G Dielectric, 1,000 VDC – 3,500 VDC (Industrial Grade)

Soldering Process

Recommended Soldering Technique:

• Solder reflow only

Recommended Reflow Soldering Profile:

KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),

convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme

thermal stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the

IPC/J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow

passes at these conditions.

Profile Feature

Termination Finish

SnPb

100% Matte Sn

Preheat/Soak

Temperature Minimum (T

100°C

150°C

Temperature Maximum (T

150°C

200°C

Time (t

60 – 120 seconds

60 – 120 seconds

Ramp-Up Rate (T

3°C/second

maximum

3°C/second

maximum

Liquidous Temperature (T

183°C

217°C

Time Above Liquidous (t

60 – 150 seconds

60 – 150 seconds

Peak Temperature (T

235°C

260°C

Time Within 5°C of Maximum

Peak Temperature (t

20 seconds

maximum

30 seconds

maximum

Ramp-Down Rate (T

6°C/second

maximum

6°C/second

maximum

Time 25°C to Peak

Temperature

6 minutes

maximum

8 minutes

maximum

Note 1: All temperatures refer to the center of the package, measured on the

capacitor body surface that is facing up during assembly reflow.

Time

T

smin

25

T

smax

T

L

T

P

Maximum Ramp Up Rate = 3ºC/sec

Maximum Ramp Down Rate = 6ºC/sec

t

P

t

L

t

s

25ºC to Peak