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C1206H124D8GACT050 Datasheet(PDF) 10 Page - Kemet Corporation |
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C1206H124D8GACT050 Datasheet(HTML) 10 Page - Kemet Corporation |
10 / 19 page © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/23/2014 10 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Table 4 – Performance & Reliability: Test Methods and Conditions Product Qualification Test Plan Reliability/Environmental Tests per MIL–STD–202//JESD22 High Temperature Life 200°C rated voltage 2,000 hours Load Humidity 85°C /85%RH rated voltage 1,000 hours Low Voltage Humidity 85°C /85%RH, 1.5 V, 1,000 hours Temperature Cycling -55°C to +200°C, 50 Cycles Thermal Shock -55°C to +150°C, 20 seconds transfer, 15 minute dwell, 300 cycles Moisture Resistance Cycled Temp/RH 0 V, 10 cycles @ 24 hours each Physical, Mechanical & Process Tests per MIL–STD 202/JIS–C–6429 Resistance to Solvents Include Aqueous wash chemical, OKEM Clean or equivalent Mechanical Shock and Vibration Method 213: Figure 1, Condition F Method 204: 5 gs for 20 minutes 12 cycles Resistance to Soldering Heat Condition B, no per-heat of samples, Single Wave Solder Terminal Strength Force of 1.8 kg for 60 seconds Board Flex Appendix 2, Note: 3.0 mm (minimum) Storage and Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of receipt. |
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