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T528W337M002APE0097280 Datasheet(PDF) 11 Page - Kemet Corporation

Part # T528W337M002APE0097280
Description  T528 Low ESL Polymer Electrolytic for CPU/GPU Decoupling
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Manufacturer  KEMET [Kemet Corporation]
Direct Link  http://www.kemet.com
Logo KEMET - Kemet Corporation

T528W337M002APE0097280 Datasheet(HTML) 11 Page - Kemet Corporation

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© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
T2018_T528 • 5/8/2017 11
11
KEMET Organic Capacitor (KO-CAP®) – Miniature
T528 Low ESL Polymer Electrolytic for CPU/GPU Decoupling
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
Po
T
F
W
Center Lines of Cavity
Ao
Bo
User Direction of Unreeling
Cover Tape
Ko
B 1 is for tape feeder reference only,
including draft concentric about B
o
.
T2
ØD 1
ØDo
B 1
S 1
T1
E 1
E 2
P 1
P 2
Embossment
For cavity size,
see Note 1 Table 4
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
Table 4 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
D
0
D
1 Minimum
Note1
E
1
P
0
P
2
RReference
Note2
S
1 Minimum
Note3
T Maximum
T
1
Maximum
8 mm
1.5+0.10/−0.0
(0.059+0.004/−0.0)
1.0
(0.039)
1.75±0.10
(0.069±0.004)
4.0±0.10
(0.157±0.004)
2.0±0.05
(0.079±0.002)
25.0
(0.984)
0.600
(0.024)
0.600
(0.024)
0.100
(0.004)
12 mm
1.5
(0.059)
30
(1.181)
16 mm
2.0±0.1
(0.079±0.059)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment
location and hole location shall be applied independent of each other.
2. The tape, with or without components, shall pass around R without damage (see Figure 4).
3. If S
1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481–D, paragraph 4.3, section b).
4. B
1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A
0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 2).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 mm and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see
Figure 3).
(e) see Addendum in EIA Standard 481–D for standards relating to more precise taping requirements.
Variable Dimensions — Millimeters (Inches)
Tape Size
Pitch
B
1 Maximum
Note4
E
2 Minimum
F
P
1
T
2 Maximum W Maximum A0, B0 & K0
8 mm
Single (4 mm)
4.35
(0.171)
6.25
(0.246)
3.5±0.05
(0.138±0.002)
2.0±0.05 or 4.0±0.10
(0.079±0.002 or 0.157±0.004)
2.5
(0.098)
8.3
(0.327)
Note5
12 mm
Single (4 mm)
&Double(8
mm)
8.2
(0.323)
10.25
(0.404)
5.5±0.05
(0.217±0.002)
2.0±0.05 (0.079±0.002) or
4.0±0.10 (0.157±0.004) or
8.0±0.10 (0.315 ±0.004)
4.6
(0.181)
12.3
(0.484)
16 mm
Triple (12 mm)
12.1
(0.476)
14.25
(0.561)
7.5±0.10
(0.295±0.004)
4.0±0.10 (0.157±0.004)
to 12.0±0.10 (0.472±0.004)
8.0 (0.315)
16.3
(0.642)


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