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C2220H124M5GALT050 Datasheet(PDF) 2 Page - Kemet Corporation |
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C2220H124M5GALT050 Datasheet(HTML) 2 Page - Kemet Corporation |
2 / 19 page © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1001_C0G_200C_SMD • 7/23/2014 2 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade) Dimensions – Millimeters (Inches) L B W S T EIA Size Code Metric Size Code L Length W Width T Thickness B Bandwidth S Separation Minimum Mounting Technique 0402 1005 1.00 (.040) ±0.05 (.002) 0.50 (.020) ±0.05 (.002) See Table 2 for Thickness 0.30 (.012) ±0.10 (.004) 0.30 (.012) Solder Reflow Only 0603 1608 1.60 (.063) ±0.15 (.006) 0.80 (.032) ±0.15 (.006) 0.35 (.014) ±0.15 (.006) 0.70 (.028) Solder Wave or Solder Reflow 0805 2012 2.00 (.079) ±0.20 (.008) 1.25 (.049) ±0.20 (.008) 0.50 (0.02) ±0.25 (.010) 0.75 (.030) 1206 3216 3.20 (.126) ±0.20 (.008) 1.60 (.063) ±0.20 (.008) 0.50 (0.02) ±0.25 (.010) N/A 1210 3225 3.20 (.126) ±0.20 (.008) 2.50 (.098) ±0.20 (.008) 0.50 (0.02) ±0.25 (.010) Solder Reflow Only 1812 4532 4.50 (.177) ±0.30 (.012) 3.20 (.126) ±0.30 (.012) 0.60 (.024) ±0.35 (.014) 2220 5650 5.70 (.224) ±0.40 (.016) 5.00 (.197) ±0.40 (.016) 0.60 (.024) ±0.35 (.014) Benefits • -55°C to +200°C operating temperature range • Lead (Pb)-Free, RoHS and REACH compliant • EIA 0402, 0603, 0805, 1206, 1210, 1812, and 2220 case sizes • DC voltage ratings of 10 V, 16 V, 25 V, 50 V, 100 V, and 200 V • Capacitance offerings ranging from 0.5 pF up to 0.47 μF • Available capacitance tolerances of ±0.10 pF, ±0.25 pF, ±0.5 pF, ±1%, ±2%, ±5%, ±10% or ±20% • No piezoelectric noise• Extremely low ESR and ESL • High thermal stability • High ripple current capability • Preferred capacitance solution at line frequencies and into the MHz range • No capacitance change with respect to applied rated DC voltage • Negligible capacitance change with respect to temperature from -55°C to +200°C • No capacitance decay with time • Non-polar device, minimizing installation concerns • 100% pure matte tin-plated termination finish allowing for excellent solderability Applications Typical applications include critical timing, tuning, circuits requiring low loss, circuits with pulse, high current, decoupling, bypass, filtering, transient voltage suppression, blocking and energy storage for use in extreme environments such as down-hole exploration, aerospace engine compartments and geophysical probes. |
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