Broadcom

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ACPL-W611/ACPL-P611

Data Sheet

Reflow Soldering Profile

The recommended reflow soldering conditions are per JEDEC Standard J-STD-020 (latest revision). Non-halide flux should be used.

Regulatory Information

The ACPL-W611 and ACPL-P611 is approved/pending approval by the following organizations:

Insulation and Safety-Related Specifications

IEC/EN/DIN EN 60747-5-5 (Option 060 only)

Approval

UL

CSA

Approval under CSA Component Acceptance Notice #5, File CA 88324.

Parameter

Symbol

ACPL-P611

ACPL-W611

Units

Conditions

Minimum External Air Gap

(External Clearance)

L(101)

7

8

mm

Measured from input terminals to output

terminals, shortest distance through air.

Minimum External Tracking

(External Creepage)

L(102)

8

8

mm

Measured from input terminals to output

terminals, shortest distance path along body.

Minimum Internal Plastic Gap

(Internal Clearance)

0.08

0.08

mm

Through insulation distance conductor to

conductor, usually the straight line distance

thickness between the emitter and detector.

Tracking Resistance

(Comparative Tracking Index)

CTI

175

175

V

DIN IEC 112/VDE 0303 Part 1

Isolation Group

IIIa

IIIa

Material Group (DIN VDE 0110, 1/89, Table 1)