Specifications and information are subject to change without notice

WJ Communications, Inc

• Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com

August 2004

ECP053

1/2 Watt, High Linearity InGaP HBT Amplifier

Product Information

The Communications Edge

TM

ECP053G (SOIC-8 Package) Mechanical Information

Outline Drawing

Land Pattern

Thermal Specifications

Parameter

Rating

Operating Case Temperature

-40 to +85

° C

Thermal Resistance, Rth

(1)

62

° C / W

Junction Temperature, Tjc

(2)

162

° C

Notes:

1. The thermal resistance is referenced from the junction-

to-case at a case temperature of 85

° C. Tjc is a function

of the voltage at pins 6 and 7 and the current applied to

pins 6, 7, and 8 and can be calculated by:

Tjc = Tcase + Rth * Vcc * Icc

2. This corresponds to the typical biasing condition of +5V,

250 mA at an 85

° C case temperature. A minimum

MTTF of 1 million hours is achieved for junction

temperatures below 247

° C.

Product Marking

The component will be marked with an

“ECP053G” designator with an alphanumeric

lot code on the top surface of the package.

Tape and reel specifications for this part are

located on the website in the “Application

Notes” section.

ESD / MSL Information

ESD Rating:

Class 1B

Value:

Passes between 500 and 1000V

Test:

Human Body Model (HBM)

Standard:

JEDEC Standard JESD22-A114

MSL Rating: Level 3 at +235

° C convection reflow

Standard:

JEDEC Standard J-STD-020

Functional Diagram

Function

Pin No.

Vref

1

Input

3

Output

6, 7

Vbias

8

GND

Backside Paddle

N/C or GND

2, 4, 5

Mounting Config. Notes

1.

A heatsink underneath the area of the PCB for the mounted

device is strictly required for proper thermal operation.

Damage to the device can occur without the use of one.

2.

Ground / thermal vias are critical for the proper performance

of this device.

Vias should use a .35mm (#80 / .0135”)

diameter drill and have a final plated thru diameter of .25

mm (.010”).

3.

Add as much copper as possible to inner and outer layers

near the part to ensure optimal thermal performance.

4.

Mounting screws can be added near the part to fasten the

board to a heatsink. Ensure that the ground / thermal via

region contacts the heatsink.

5.

Do not put solder mask on the backside of the PC board in

the region where the board contacts the heatsink.

6.

RF trace width depends upon the PC board material and

construction.

7.

Use 1 oz. Copper minimum.

8

All dimensions are in millimeters (inches). Angles are in

degree

MTTF vs. GND Tab Temperature

100

1000

10000

100000

60

70

80

90

100

110

120

Tab Temperature (°C)

1

2

3

4

8

7

6

5