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LM139-MIL Datasheet(PDF) 4 Page - Texas Instruments |
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LM139-MIL Datasheet(HTML) 4 Page - Texas Instruments |
4 / 19 page 4 LM139-MIL SLCS160 – JUNE 2017 www.ti.com Product Folder Links: LM139-MIL Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values, except differential voltages, are with respect to network ground. (3) Differential voltages are at xIN+ with respect to xIN–. (4) Input current flows through parasitic diode to ground and will turn on parasitic transistors that will increase ICC and may cause output to be incorrect. Normal operation resumes when input is removed. (5) Short circuits from outputs to VCC can cause excessive heating and eventual destruction. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VCC Supply voltage(2) 36 V VID Differential input voltage(3) ±36 V VI Input voltage range (either input) –0.3 36 V IK Input current(4) –50 mA VO Output voltage 36 V IO Output current 20 mA Duration of output short circuit to ground(5) Unlimited TJ Operating virtual-junction temperature 150 °C Case temperature for 60 s FK package 260 °C Lead temperature 1.6 mm (1/16 in) from case for 60 s J package 300 °C Tstg Storage temperature –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±500 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±750 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Supply voltage 2 30 V TJ Junction temperature –55 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information THERMAL METRIC(1) LM139-MIL UNIT D (SOIC) J (CDIP) W (CFP) FK (LCCC) RθJA Junction-to-ambient thermal resistance 98.8 89.5 156.2 82.5 °C/W RθJC(top) Junction-to-case (top) thermal resistance 64.3 46.1 86.7 60.7 °C/W RθJB Junction-to-board thermal resistance 59.7 78.7 154.6 59.4 °C/W ψJT Junction-to-top characterization parameter 25.7 3 56.5 53 °C/W ψJB Junction-to-board characterization parameter 59.3 71.8 133.5 58.4 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — 24.2 14.3 9.7 °C/W |
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