5

LMT87, LMT87-Q1

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SNIS170D – JANUARY 2014 – REVISED JUNE 2017

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7.4 Recommended Operating Conditions

MIN

MAX

UNIT

Specified temperature

°C

°C

2.7

5.5

V

(1)

For information on self-heating and thermal response time see section Mounting and Thermal Conductivity.

(2)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report.

(3)

board as specified in JESD51-7, in an environment described in JESD51-2. Exposed pad packages assume that thermal vias are

included in the PCB, per JESD 51-5.

(4)

Changes in output due to self heating can be computed by multiplying the internal dissipation by the thermal resistance.

7.5 Thermal Information

(1)

LMT87/

LMT87-Q1

LMT87LP

LMT87LPG

UNIT

DCK (SOT/SC70)

LP/LPM (TO-92)

LPG (TO-92S)

5 PINS

3 PINS

3 PINS

275

167

130.4

°C/W

Junction-to-case (top) thermal resistance

84

90

64.2

°C/W

Junction-to-board thermal resistance

56

146

106.2

°C/W

Junction-to-top characterization parameter

1.2

35

14.6

°C/W

Junction-to-board characterization parameter

55

146

106.2

°C/W