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GS8673ET18BGK-675I Datasheet(PDF) 10 Page - GSI Technology

Part # GS8673ET18BGK-675I
Description  72Mb SigmaDDR-IIIe??Burst of 2 ECCRAM?
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Manufacturer  GSI [GSI Technology]
Direct Link  http://www.gsitechnology.com
Logo GSI - GSI Technology

GS8673ET18BGK-675I Datasheet(HTML) 10 Page - GSI Technology

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GS8673ET18/36BK-675/625/550/500
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.06 5/2012
10/34
© 2011, GSI Technology
DQ Input Termination Control
A robust methodology has been developed for these devices for controlling when DQ input termination is enabled and disabled
during Write-to-Read and Read-to-Write transitions. Specifically, the methodology can ensure that the DQ bus is never pulled to
VDDQ/2 by the ECCRAM and/or Memory Controller input termination during the transitions (or at any other time). Such a
condition is best avoided, because if an input signal is pulled to VDDQ/2 (i.e. to VREF - the switch point of the diff-amp receiver), it
could cause the receiver to enter a meta-stable state and consume more power than it normally would. This could result in the
device’s operating currents being higher.
The fundamental concept of the methodology is - both the ECCRAM and the Memory Controller drive the DQ bus Low (with DQ
input termination disabled) at all times except:
1. When a particular device is driving the DQ bus with valid data, and
2. From shortly before to shortly after a particular device is receiving valid data on the DQ bus, during which time the receiving
device enables its DQ termination.
And, during Write-to-Read and Read-to-Write transitions, each device enables and disables its DQ termination while the other
device is driving DQ Low, thereby ensuring that the DQ bus is never pulled to VDDQ/2.
Note: This methodology also reduces power consumption, since there will be no DC current through either device’s DQs when
both devices are driving Low.
In order for this methodology to work as described, the Memory Controller must have the ability to:
1. Place the ECCRAM into “DQ Drive Low Mode” at the appropriate times (i.e. before and after the ECCRAM drives valid Read
Data), and
2. Place the ECCRAM into “DQ Termination Mode” at the appropriate times (i.e. before, during, and after the ECCRAM receives
valid Write Data).
That ability is provided via the existing R/W control pin.
When the ECCRAM samples R/W High (regardless of the state of LD), it disables its DQ termination, and drives the DQ bus Low
except while driving valid Read Data in response to Read operations.
When the ECCRAM samples R/W Low (regardless of the state of LD), it disables its DQ drivers, and enables its DQ termination.
Note that NOPs initiated with R/W High and LD High are referred to as “NOPr” operations.
Note that NOPs initiated with R/W Low and LD High are referred to as “NOPw” operations.
This extended definition of the R/W control pin allows the Memory Controller to:
Place the ECCRAM in DQ Termination Mode, via NOPw operations, before initiating Write operations.
Keep the ECCRAM in DQ Termination Mode, via NOPw operations, after initiating Write operations.
Place the ECCRAM in DQ Drive Low Mode, via NOPr operations, before initiating Read operations.
Keep the ECCRAM in DQ Drive Low Mode, via NOPr operations, after initiating Read operations.


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