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SED1530D0 Datasheet(PDF) 4 Page - Epson Company |
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SED1530D0 Datasheet(HTML) 4 Page - Epson Company |
4 / 13 page 4 SED1530 Series 1 51 52 86 87 137 138 172 s PIN LAYOUT Chip Size: 6.65x4.57 mm Pad Pitch: 118 µm (Min.) SED153*D*A (Aluminum pad model) Pad Center Size: 90x90 µm Chip Thickness: 300 µm SED153*D*B (Gold bump model) Bump Size: 76x76 µm Bump Height: 23 µm (Typ.) Chip Thickness: 625 µm |
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