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ENW89823A3KF Datasheet(PDF) 2 Page - Panasonic Semiconductor |
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ENW89823A3KF Datasheet(HTML) 2 Page - Panasonic Semiconductor |
2 / 60 page CLASSIFICATION PRODUCT SPECIFICATION No. DS-13xx-2400-102 REV. 4.9 SUBJECT CLASS 1 or 2 BLUETOOTH MODULE PAGE 2 of 60 CUSTOMER’S CODE PAN13XX Core Specification PANASONIC’S CODE See Chapter Ordering Information DATE 09.03.2017 PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de TABLE OF CONTENTS 1 Scope of this Document ................................................................................................5 1.1 New PAN13x5B, PAN13x6B ................................................................................5 2 Key Features.................................................................................................................6 3 Applications for the Module ...........................................................................................7 4 Description for the Module.............................................................................................7 5 Detailed Description ......................................................................................................8 5.1 Terminal Layout ...................................................................................................8 5.1.1 5.1.1. Terminal Layout PAN131x without antenna...................................8 5.1.2 5.1.2. Terminal Layout PAN132x with antenna........................................9 5.2 Pin Description ...................................................................................................10 5.3 Device Power Supply .........................................................................................11 5.4 Clock Inputs .......................................................................................................12 6 Bluetooth Features ......................................................................................................12 7 Block Diagram.............................................................................................................13 8 Test Conditions ...........................................................................................................14 9 General Device Requirements and Operation .............................................................14 9.1 Absolute Maximum Ratings................................................................................14 9.2 Recommended Operating Conditions.................................................................15 9.3 Current Consumption .........................................................................................16 9.4 General Electrical Characteristics ......................................................................17 9.5 nSHUTD Requirements......................................................................................17 9.6 External Digital Slow Clock Requirements..........................................................17 10 Host Controller Interface .............................................................................................18 11 Audio/Voice Codec Interface .......................................................................................19 11.1 PCM Hardware Interface....................................................................................19 11.2 Data Format .......................................................................................................19 11.3 Frame Idle Period...............................................................................................20 11.4 Clock-Edge Operation ........................................................................................21 11.5 Two-Channel PCM Bus Example .......................................................................21 11.6 Audio Encoding ..................................................................................................21 11.7 Improved Algorithm For Lost Packets.................................................................22 11.8 Bluetooth/PCM Clock Mismatch Handling ..........................................................22 11.9 Bluetooth Inter-IC Sound (I2S) ...........................................................................22 11.10Current Consumption for Different Bluetooth Scenarios .....................................23 12 Bluetooth RF Performance ..........................................................................................23 13 Soldering Temperature-Time Profile (for reflow soldering)...........................................26 13.1 For lead solder ...................................................................................................26 13.2 For leadfree solder .............................................................................................27 14 Module Dimension.......................................................................................................28 |
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