TAS5101

SLES039 – JUNE 2002

11

www.ti.com

THERMAL INFORMATION

The thermally enhanced DAP package is based on the 32-pin HTSSOP, but includes a thermal pad (see

Figure 4) to provide an effective thermal contact between the IC and the PWB.

Traditionally, surface mount and power have been mutually exclusive terms. A variety of scaled-down TO-220

type packages have leads formed as gull wings to make them applicable for surface-mount applications. These

packages, however, have two shortcomings: they do not address the very low profile requirements (<2 mm) of

many of today’s advanced systems, and they do not offer a terminal-count high enough to accommodate

increasing integration. On the other hand, traditional low-power surface-mount packages require

power-dissipation derating that severely limits the usable range of many high-performance analog circuits.

The PowerPAD package (thermally enhanced HTSSOP) combines fine-pitch surface-mount technology with

thermal performance comparable to much larger power packages.

The PowerPAD package is designed to optimize the heat transfer to the PWB. Because of the very small size

and limited mass of a HTSSOP package, thermal enhancement is achieved by improving the thermal

conduction paths that remove heat from the component. The thermal pad is formed using a patented lead-frame

design and manufacturing technique to provide a direct connection to the heat-generating IC. When this pad

is soldered or otherwise thermally coupled to an external heat dissipater, high power dissipation in the ultrathin,

fine-pitch, surface-mount package can be reliably achieved.

DIE

DIE

Thermal

Pad

Side View (a)

End View (b)

Bottom View (c)

Figure 3. Views of Thermally Enhanced DAP Package