SFH6156

www.vishay.com

Vishay Semiconductors

Rev. 2.8, 21-Apr-17

3

Document Number: 83671

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Notes

• The thermal model is represented in the thermal network below. Each resistance value given in this model can be used to calculate the

temperatures at each node for a given operating condition. The thermal resistance from board to ambient will be dependent on the type of

PCB, layout and thickness of copper traces. For a detailed explanation of the thermal model, please reference Vishay’s thermal

characteristics of optocouplers application note

Note

• Minimum and maximum values are testing requirements. Typical values are characteristics of the device and are the result of engineering

evaluation. Typical values are for information only and are not part of the testing requirements

THERMAL CHARACTERISTICS

PARAMETER

SYMBOL

VALUE

UNIT

LED power dissipation

100

mW

Output power dissipation

150

mW

Maximum LED junction temperature

125

°C

Maximum output die junction temperature

125

°C

Thermal resistance, junction emitter to board

173

°C/W

Thermal resistance, junction emitter to case

149

°C/W

Thermal resistance, junction detector to board

111

°C/W

Thermal resistance, junction detector to case

127

°C/W

Thermal resistance, junction emitter to

junction detector

95

°C/W

195

°C/W

3573

°C/W

PARAMETER

TEST CONDITION

PART

SYMBOL

MIN.

TYP.

MAX.

UNIT

INPUT

Forward voltage

-

1.25

1.65

V

Reverse current

-0.01

10

μA

Capacitance

-13

-

pF

OUTPUT

Collector emitter capacitance

-5.2

-

pF

Collector emitter leakage current

SFH6156-1

-

2

50

nA

SFH6156-2

-

2

50

nA

SFH6156-3

-

5

100

nA

SFH6156-4

-

5

100

nA

COUPLER

Collector emitter saturation voltage

-

0.25

0.4

V

Coupling capacitance

-0.4

-

pF

T

A

θ

CA

T

C

T

JD

T

JE

T

B

θ

EC

θ

EB

θ

DC

θ

DB

θ

BA

θ

DE

T

A

19996

Package