SFH6345

www.vishay.com

Vishay Semiconductors

Rev. 2.2, 03-Aug-15

2

Document Number: 83680

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Note

• Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not

implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute

maximum ratings for extended periods of the time can adversely affect reliability.

Notes

• Minimum and maximum values are testing requirements. Typical values are characteristics of the device and are the result of engineering

evaluation. Typical values are for information only and are not part of the testing requirements.

PARAMETER

TEST CONDITION

SYMBOL

VALUE

UNIT

INPUT

Reverse voltage

3V

DC forward current

25

mA

Surge forward current

1A

Power dissipation

45

mW

OUTPUT

Supply voltage

-0.5 to 30

V

Output voltage

-0.5 to 25

V

Output current

8mA

Power dissipation

100

mW

COUPLER

Storage temperature range

-55 to +150

°C

Ambient temperature range

-55 to +100

°C

Junction temperature

125

°C

Soldering temperature

max. 10 s, max. dip soldering:

distance to seating plane

≥ 1.5 mm

260

°C

PARAMETER

TEST CONDITION

SYMBOL

MIN.

TYP.

MAX.

UNIT

INPUT

Forward voltage

-

1.33

1.9

V

Reverse current

-

0.5

10

μA

Capacitance

-30

-

pF

Thermal resistance

-

700

-

K/W

OUTPUT

Supply current, logic high

-0.01

1

μA

-0.01

2

μA

Output current, output high

-

0.003

0.5

μA

-0.01

1

μA

-

-

50

μA

Collector emitter capacitance

-3

-

pF

Thermal resistance

-

300

-

K/W

COUPLER

Coupling capacitance

-0.6

-

pF

Collector emitter saturation voltage

-0.1

0.4

V

Logic low supply current

-

80

200

μA