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NCP380LSNAJAAT1G Datasheet(PDF) 3 Page - ON Semiconductor |
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NCP380LSNAJAAT1G Datasheet(HTML) 3 Page - ON Semiconductor |
3 / 23 page NCP380, NCV380 www.onsemi.com 3 Table 2. MAXIMUM RATINGS Rating Symbol Value Unit From IN to OUT Pins: Input/Output (Note 1) VIN , VOUT −7.0 to +7.0 V IN, OUT, EN, ILIM, FLAG, Pins: Input/Output (Note 1) VEN, VILIM, VFLAG, VIN, VOUT −0.3 to +7.0 V FLAG Sink Current ISINK 1 mA ILIM Source Current ILIM 1 mA ESD Withstand Voltage (IEC 61000−4−2) (Output Only , when Bypassed with 1.0 mF Capacitor Minimum) ESD IEC 15 Air, 8 Contact kV Human Body Model (HBM) ESD Rating (Note 2) ESD HBM 2,000 V Machine Model (MM) ESD Rating (Notes 2 and 3) ESD MM 200 V Latch-up Protection (Note 4) Pins IN, OUT, EN, ILIM, FLAG LU 100 mA Maximum Junction Temperature Range (Note 6) TJ −40 to +TSD °C Storage Temperature Range TSTG −40 to +150 °C Moisture Sensitivity (Note 5) MSL Level 1 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. According to JEDEC standard JESD22−A108. 2. This device series contains ESD protection and passes the following tests: Human Body Model (HBM) ±2.0 kV per JEDEC standard: JESD22−A114 for all pins. Machine Model (MM) ±200 V per JEDEC standard: JESD22−A115 for all pins. 3. Except EN pin, 150 V. 4. Latch up Current Maximum Rating: ±100 mA per JEDEC standard: JESD78 class II. 5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020. 6. A thermal shutdown protection avoids irreversible damage on the device due to power dissipation. Table 3. OPERATING CONDITIONS Symbol Parameter Conditions Min Typ Max Unit VIN Operational Power Supply 2.5 − 5.5 V VEN Enable Voltage 0 − 5.5 TA Ambient Temperature Range −40 25 +85 °C TJ Junction Temperature Range −40 25 +125 °C RILIM Resistor from ILIM to GND Pin 5.0 − 250 k W ISINK FLAG Sink Current − − 1.0 mA CIN Decoupling Input Capacitor 1.0 − − mF COUT Decoupling Output Capacitor USB Port per Hub 120 − − mF RqJA Thermal Resistance Junction-to-Air UDFN−6 Package (Notes 7 and 8) − 120 − °C/W TSOP−5 Package (Notes 7 and 8) − 305 − °C/W TSOP−6 Package (Notes 7 and 8) − 280 − °C/W IOUT Maximum DC Current UDFN−6 Package − − 2.1 A TSOP−5, TSOP−6 Package − − 1.0 A PD Power Dissipation Rating (Note 9) TA v 25°C UDFN−6 Package − 830 − mW TSOP−5 Package − 325 − mW TSOP−6 Package − 350 − mW TA = 85°C UDFN−6 Package − 325 − mW TSOP−5 Package − 130 − mW TSOP−6 Package − 145 − mW 7. A thermal shutdown protection avoids irreversible damage on the device due to power dissipation. 8. The RqJA is dependent of the PCB heat dissipation. Board used to drive this data was a 2” × 2” NCP380EVB board. It is a 2 layers board with 2-once copper traces on top and bottom of the board. Exposed pad is connected to ground plane for UDFN−6 version only. 9. The maximum power dissipation (PD) is given by the following formula: P D + T JMAX * TA RqJA |
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