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AB104S Datasheet(PDF) 1 Page - Chip Integration Technology Corporation

Part # AB104S
Description  1A Miniature Glass Passivated Single-Phase Surface Mount Bridge Rectifiers
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Manufacturer  CITC [Chip Integration Technology Corporation]
Direct Link  http://www.citcorp.com.tw/english/index.php
Logo CITC - Chip Integration Technology Corporation

AB104S Datasheet(HTML) 1 Page - Chip Integration Technology Corporation

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1
Dimensions in inches and (millimeters)
Features
■ Mechanical data
■ Maximum ratings and electrical characteristics
Rating at 25
ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
OC
Outline
Ideal for printed circuit board.
Ideal for automated replacement.
Reliable low cost construction utilizing molded plastic
technology results in inexpensive product.
Glass passivated chip junctions.
Ηigh temperature soldering guaranteed:
O
260 C /10 seconds
Rating to 1000V PRV.
Suffix "G" indicates Halogen-free part, ex.AB102SG.
ABS
• Case : Molded plastic, ABS
• Terminals : Solder plated, solderable per
MIL-STD-750, Method 2026
• Polarity : Symbol molded on body
• Epoxy:UL94-V0 rated flame retardant
AB102S THRU AB110S
1A Miniature Glass Passivated Single-Phase Surface Mount Bridge Rectifiers
Operating temperature
O
T ( C)
J
-55 ~ +150
Max.
forward voltage
O
@0.4A, T = 25 C
A
V (V)
F
Max. DC
blocking voltage
V (V)
R
Max.
RMS voltage
V
(V)
RMS
280
420
560
140
700
Max.
repetitive peak
reverse voltage
V
(V)
RRM
400
600
800
200
1000
Marking code
AB104S
AB106S
AB108S
AB102S
AB110S
Symbol
ABS4
ABS6
ABS8
ABS2
ABS10
400
600
800
200
1000
0.95
I
O
I
FSM
I
R
2
I t
Average rectified output current
Forward surge current
Reverse current
Current squared time
Parameter
8.3ms single half sine-wave superimposed on
rate load (JEDEC method)
O
V
= V
T
= 25 C
R
RRM
A
O
V
= V
T
= 125 C
R
RRM
A
Conditions
Symbol
MIN.
TYP.
MAX.
UNIT
3.7
500
10
30
A
A
uA
2
A S
Document ID : DS-22B16
Issued Date : 2010/05/05
Revised Date : 2012/05/31
Revision : C
.177(4.50)
.056(1.42)
.006(0.15)
.028(0.7)
.059(1.50)
.200(5.1)
.028(0.70)
.169(4.30)
.012(0.3)
MAX
.193(4.9)
.024(0.60)
+
.002(0.05)
.161(4.1)
.154(3.9)
MAX
.252(6.4)
.236(6.0)
.010(0.25)
.006(0.15)
1.0
O
on aluminum substrate at T = 25 C
A
R
θJA
Thermal resistance
62.5
OC/W
T
STG
Storage temperature
-55
+150
OC
O
t < 8.3ms, T = 25 C
J
junction to ambient


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