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AB104S Datasheet(PDF) 1 Page - Chip Integration Technology Corporation |
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AB104S Datasheet(HTML) 1 Page - Chip Integration Technology Corporation |
1 / 3 page 1 Dimensions in inches and (millimeters) Features ■ ■ Mechanical data ■ Maximum ratings and electrical characteristics Rating at 25 ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. OC Outline ■ Ideal for printed circuit board. Ideal for automated replacement. Reliable low cost construction utilizing molded plastic technology results in inexpensive product. Glass passivated chip junctions. Ηigh temperature soldering guaranteed: O 260 C /10 seconds • • • • • • • Rating to 1000V PRV. Suffix "G" indicates Halogen-free part, ex.AB102SG. ABS • Case : Molded plastic, ABS • Terminals : Solder plated, solderable per MIL-STD-750, Method 2026 • Polarity : Symbol molded on body • Epoxy:UL94-V0 rated flame retardant AB102S THRU AB110S 1A Miniature Glass Passivated Single-Phase Surface Mount Bridge Rectifiers Operating temperature O T ( C) J -55 ~ +150 Max. forward voltage O @0.4A, T = 25 C A V (V) F Max. DC blocking voltage V (V) R Max. RMS voltage V (V) RMS 280 420 560 140 700 Max. repetitive peak reverse voltage V (V) RRM 400 600 800 200 1000 Marking code AB104S AB106S AB108S AB102S AB110S Symbol ABS4 ABS6 ABS8 ABS2 ABS10 400 600 800 200 1000 0.95 I O I FSM I R 2 I t Average rectified output current Forward surge current Reverse current Current squared time Parameter 8.3ms single half sine-wave superimposed on rate load (JEDEC method) O V = V T = 25 C R RRM A O V = V T = 125 C R RRM A Conditions Symbol MIN. TYP. MAX. UNIT 3.7 500 10 30 A A uA 2 A S Document ID : DS-22B16 Issued Date : 2010/05/05 Revised Date : 2012/05/31 Revision : C .177(4.50) .056(1.42) .006(0.15) .028(0.7) .059(1.50) .200(5.1) .028(0.70) .169(4.30) .012(0.3) MAX .193(4.9) .024(0.60) + .002(0.05) .161(4.1) .154(3.9) MAX .252(6.4) .236(6.0) .010(0.25) .006(0.15) 1.0 O on aluminum substrate at T = 25 C A R θJA Thermal resistance 62.5 OC/W T STG Storage temperature -55 +150 OC O t < 8.3ms, T = 25 C J junction to ambient |
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