iC-HX

3-CHANNEL DIFFERENTIAL COLD LINE DRIVER

Rev D1, Page 4/14

ABSOLUTE MAXIMUM RATINGS

Beyond these values damage may occur; device operation is not guaranteed. Absolute Maximum Ratings are no Operating Conditions.

Integrated circuits with system interfaces, e.g. via cable accessible pins (I/O pins, line drivers) are per principle endangered by injected

interferences, which may compromise the function or durability. The robustness of the devices has to be verified by the user during system

development with regards to applying standards and ensured where necessary by additional protective circuitry. By the manufacturer

suggested protective circuitry is for information only and given without responsibility and has to be verified within the actual system with

respect to actual interferences.

Item

Symbol

Parameter

Conditions

Unit

No.

Min.

Max.

G001 VCC

Voltage at VCC

0

7

V

G002 VBx

Voltages at VB1, VB2, VB3

0

40

V

G003 V()

Voltage at E1...6, A1...6, DIFF, ENA,

TNER, NXS, CXS1, CXS6

0

40

V

G004 I(Ax)

Current in Ax (x=1...6)

-800

800

mA

G005 I(Ex)

Current in E1...E6, Diff, ENA, TNER,

NXS

-4

4

mA

G006 V(NER)

Voltage at NER

0

40

V

G007 I(NER)

Current in NER

-4

25

mA

G008 V()

ESD Suceptibility at all pins

CDM (JEDEC Standard No. 22-C101F)

500

V

G009 Tj

Operating Junction Temperature

-40

140

°C

G010 Ts

Storage Temperature Range

-40

150

°C

THERMAL DATA

Operating conditions: VB1. . . 3 = 4.5. . . 40 V, VCC = 4.5. . . 5.5 V or VB1. . . 3 = VCC = 4. . . 5.5 V

Item

Symbol

Parameter

Conditions

Unit

No.

Min.

Typ.

Max.

T01 Ta

Operating Ambient Temperature Range

-40

125

°C

T02 Rthja

Thermal Resistance Chip to Ambient

surface mounted, thermal pad soldered to

approx. 2 cm² heat sink

40

K/W

All voltages are referenced to ground unless otherwise stated.

All currents flowing into the device pins are positive; all currents flowing out of the device pins are negative.