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74LVT125PW Datasheet(PDF) 11 Page - NXP Semiconductors |
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74LVT125PW Datasheet(HTML) 11 Page - NXP Semiconductors |
11 / 15 page 9397 750 14703 © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Product data sheet Rev. 05 — 10 February 2005 11 of 15 Philips Semiconductors 74LVT125 3.3 V quad buffer; 3-state Fig 11. Package outline TSSOP14 (SOT402-1) UNIT A1 A2 A3 bp cD (1) E (2) (1) eHE LLp QZ y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.72 0.38 8 0 o o 0.13 0.1 0.2 1 DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 SOT402-1 MO-153 99-12-27 03-02-18 w M b p D Z e 0.25 17 14 8 θ A A1 A2 L p Q detail X L (A ) 3 HE E c v M A X A y 0 2.5 5 mm scale TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1 A max. 1.1 pin 1 index |
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