iC-SG85 BLCC SG1C

Infrared LED

Rev B4, Page 2/6

ABSOLUTE MAXIMUM RATINGS

Beyond these values damage may occur (Ta = 25°C, unless otherwise noted)

Item

Symbol

Parameter

Conditions

Unit

No.

Min.

Max.

G001 IF

Forward current (DC)

100

mA

G002 IFSM

Surge forward current

tp ≤ 10 µs, 5 % duty cycle

1000

mA

G003 VR

Reverse voltage

5

V

G004 P

Power dissipation

temperature dependence see fig. 1

150

mW

THERMAL DATA

Item

Symbol

Parameter

Conditions

Unit

No.

Min.

Typ.

Max.

T01 Ta

Operating Ambient Temperature Range

-40

125

°C

T02 Ts

Storage Temperature Range

-40

125

°C

T03 Tpk

Soldering Temperature

tpk < 5 s, manual soldering;

260

°C

Not suitable for reflow or vapor phase

soldering.

T04 Rthja

Thermal resistance junction to ambient

300

K/W

T05 Tj

Junction Temperature

-40

125

°C

Figure 1: Maximum power dissipation with respect to temperature

All voltages are referenced to ground unless otherwise stated.

All currents flowing into the device pins are positive; all currents flowing out of the device pins are negative.