Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

K7R641884M Datasheet(PDF) 5 Page - Samsung semiconductor

Part # K7R641884M
Description  2Mx36 & 4Mx18 QDRTM II b4 SRAM
Download  18 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  SAMSUNG [Samsung semiconductor]
Direct Link  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

K7R641884M Datasheet(HTML) 5 Page - Samsung semiconductor

  K7R641884M Datasheet HTML 1Page - Samsung semiconductor K7R641884M Datasheet HTML 2Page - Samsung semiconductor K7R641884M Datasheet HTML 3Page - Samsung semiconductor K7R641884M Datasheet HTML 4Page - Samsung semiconductor K7R641884M Datasheet HTML 5Page - Samsung semiconductor K7R641884M Datasheet HTML 6Page - Samsung semiconductor K7R641884M Datasheet HTML 7Page - Samsung semiconductor K7R641884M Datasheet HTML 8Page - Samsung semiconductor K7R641884M Datasheet HTML 9Page - Samsung semiconductor Next Button
Zoom Inzoom in Zoom Outzoom out
 5 / 18 page
background image
- 5 -
Rev 0.5
Oct. 2004
2Mx36 & 4Mx18 QDRTM II b4 SRAM
K7R643684M
K7R641884M
Preliminary
The K7R643684M and K7R641884M are 75,497,472-bits QDR(Quad Data Rate) Synchronous Pipelined Burst SRAMs.
They are organized as 2,097,152 words by 36bits for K7R643684M and 4,194,304 words by 18 bits for K7R641884M.
The QDR operation is possible by supporting DDR read and write operations through separate data output and input ports
with the same cycle. Memory bandwidth is maxmized as data can be transfered into sram on every rising edge of K and K,
and transfered out of sram on every rising edge of C and C.
And totally independent read and write ports eliminate the need for high speed bus turn around.
Address for read and write are latched on alternate rising edges of the input clock K.
Data inputs, and all control signals are synchronized to the input clock ( K or K ).
Normally data outputs are synchronized to output clocks ( C and C ), but when C and C are tied high,
the data outputs are synchronized to the input clocks ( K and K ).
Read data are referenced to echo clock ( CQ or CQ ) outputs.
Common address bus is used to access address both for read and write operations.
The internal burst counter is fiexd to 4-bit sequential for both read and write operations, reguiring tow full clock bus cycles.
Any request that attempts to interrupt a burst operation in progress is ignored.
Synchronous pipeline read and late write enable high speed operations.
Simple depth expansion is accomplished by using R and W for port selection.
Byte write operation is supported with BW0 and BW1 ( BW2 and BW3 ) pins.
IEEE 1149.1 serial boundary scan (JTAG) simplifies monitoring package pads attachment status with system.
The K7R643684M and K7R641884M are implemented with SAMSUNG's high performance 6T CMOS technology
and is available in 165pin FBGA packages. Multiple power and ground pins minimize ground bounce.
GENERAL DESCRIPTION
Read Operations
Read cycles are initiated by activating R at the rising edge of the positive input clock K.
Address is presented and stored in the read address register synchronized with K clock.
For 4-bit burst DDR operation, it will access four 36-bit or 18-bit data words with each read command.
The first pipelined data is transfered out of the device triggered by C clock following next K clock rising edge.
Next burst data is triggered by the rising edge of following C clock rising edge.
The process continues until all four data are transfered.
Continuous read operations are initated with K clock rising edge.
And pipelined data are transferred out of device on every rising edge of both C and C clocks.
In case C and C tied to high, output data are triggered by K and K insted of C and C.
When the R is disabled after a read operation,the K7R643684M and K7R641884M will first complete burst read operation
before entering into deselect mode at the next K clock rising edge.
Then output drivers disabled automatically to high impedance state.
Write cycles are initiated by activating W at the rising edge of the positive input clock K.
Address is presented and stored in the write address register synchronized with K clock.
For 4-bit burst DDR operation, it will write four 36-bit or 18-bit data words with each write command.
The first "late" data is transfered and registered in to the device synchronous with next K clock rising edge.
Next burst data is transfered and registered synchronous with following K clock rising edge.
The process continues until all four data are transfered and registered.
Continuous write operations are initated with K rising edge.
And "late writed" data is presented to the device on every rising edge of both K and K clocks.
The device disregards input data presented on the same cycle W disabled.
When the W is disabled after a read operation, the K7R643684M and K7R641884M will first complete burst read operation
before entering into deselect mode at the next K clock rising edge.
The K7R643684M and K7R641884M support byte write operations.
With activating BW0 or BW1 ( BW2 or BW3 ) in write cycle, only one byte of input data is presented.
In K7R641884M, BW0 controls write operation to D0:D8, BW1 controls write operation to D9:D17.
And in K7R643684M BW2 controls write operation to D18:D26, BW3 controls write operation to D27:D35.
Write Operations


Similar Part No. - K7R641884M

ManufacturerPart #DatasheetDescription
logo
Samsung semiconductor
K7R641884M SAMSUNG-K7R641884M Datasheet
451Kb / 19P
   2Mx36 & 4Mx18 QDR II b4 SRAM
More results

Similar Description - K7R641884M

ManufacturerPart #DatasheetDescription
logo
Samsung semiconductor
K7R643684M SAMSUNG-K7R643684M_07 Datasheet
451Kb / 19P
   2Mx36 & 4Mx18 QDR II b4 SRAM
K7R643682M SAMSUNG-K7R643682M Datasheet
364Kb / 19P
   2Mx36 & 4Mx18 & 8Mx9 QDRTM II b2 SRAM
K7R323684M SAMSUNG-K7R323684M Datasheet
195Kb / 18P
   1Mx36 & 2Mx18 QDRTM II b4 SRAM
K7R163684B SAMSUNG-K7R163684B_06 Datasheet
456Kb / 19P
   512Kx36 & 1Mx18 QDRTM II b4 SRAM
K7S3236T4C SAMSUNG-K7S3236T4C Datasheet
440Kb / 20P
   1Mx36 & 2Mx18 QDRTM II b4 SRAM
K7R643682M SAMSUNG-K7R643682M_07 Datasheet
461Kb / 20P
   2Mx36 & 4Mx18 & 8Mx9 QDR II b2 SRAM
K7J643682M SAMSUNG-K7J643682M_07 Datasheet
434Kb / 18P
   2Mx36 & 4Mx18 DDR II SIO b2 SRAM
K7Q163664B SAMSUNG-K7Q163664B_10 Datasheet
635Kb / 17P
   512Kx36 & 1Mx18 QDRTM b4 SRAM
K7I643682M SAMSUNG-K7I643682M_07 Datasheet
417Kb / 18P
   2Mx36 & 4Mx18 DDRII CIO b2 SRAM
K7N641845M SAMSUNG-K7N641845M Datasheet
455Kb / 24P
   2Mx36 & 4Mx18 Pipelined NtRAM
More results


Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18


Datasheet Download

Go To PDF Page


Link URL




Privacy Policy
ALLDATASHEET.NET
Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Contact us   |   Privacy Policy   |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com