AD7172-4BCPZ datasheet(9/62 Pages) AD

Part #	AD7172-4BCPZ

Description	ADC with True Rail-to-Rail Buffers

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Manufacturer	AD [Analog Devices]

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AD7172-4

Data Sheet

Rev. B | Page 8 of 61

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 3.

Parameter

Rating

AVDD1, AVDD2 to AVSS

−0.3 V to +6.5 V

AVDD1 to DGND

−0.3 V to +6.5 V

IOVDD to DGND

−0.3 V to +6.5 V

IOVDD to AVSS

−0.3 V to +7.5 V

AVSS to DGND

−3.25 V to +0.3 V

Analog Input Voltage to AVSS

−0.3 V to AVDD1 + 0.3 V

Reference Input Voltage to AVSS

−0.3 V to AVDD1 + 0.3 V

Digital Input Voltage to DGND

−0.3 V to IOVDD + 0.3 V

Digital Output Voltage to DGND

−0.3 V to IOVDD + 0.3 V

Analog Input/Digital Input Current

10 mA

Operating Temperature Range

−40°C to +105°C

Storage Temperature Range

−65°C to +150°C

Maximum Junction Temperature

150°C

Lead Soldering, Reflow Temperature

260°C

ESD Rating (HBM)

4 kV

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

θJA is specified for a device soldered on a JEDEC test board for

surface-mount packages.

Table 4. Thermal Resistance

Package Type

θJA

Unit

32-Lead, 5 mm × 5 mm LFCSP

1-Layer JEDEC Board

138

°C/W

4-Layer JEDEC Board

63

°C/W

4-Layer JEDEC Board with 9 Thermal Vias

41

°C/W

ESD CAUTION

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