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PESD3V3L5UY Datasheet(PDF) 8 Page - NXP Semiconductors

Part # PESD3V3L5UY
Description  Low capacitance 5-fold ESD protection diode arrays in SOT363 package
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

PESD3V3L5UY Datasheet(HTML) 8 Page - NXP Semiconductors

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2004 Mar 23
8
Philips Semiconductors
Product specification
Low capacitance 5-fold ESD protection
diode arrays in SOT363 package
PESD3V3L5UY;
PESD5V0L5UY
APPLICATION INFORMATION
The PESDxL5UY is designed for the uni-directional protection of up to five lines or bi-directional protection of four lines
from the damage caused by Electrostatic Discharge (ESD) and surge pulses. The PESDxL5UY may be used on lines
where the signal polarities are above or below ground. PESDxL5UY can withstand and provides protection from a surge
of 25 watts peak pulse power per line for a 8/20
µs waveform.
001aaa216
PESDxL5UY
GND
high speed data lines
Fig.9
Typical application for uni-directional
protection of five lines.
001aaa214
PESDxL5UY
GND
high speed data lines
Fig.10 Typical application for bi-directional
protection of four lines.
Circuit board layout and protection device placement
Circuit board layout is critical for the suppression of ESD,
Electrical Fast Transient (EFT) and surge transients. The
following guidelines are recommended:
1. The protection device should be placed as closely as
possible to the input terminal or connector.
2. The path length between the protection device and the
protected line should be as short as possible.
3. Parallel signal paths should be kept to a minimum.
4. Running protection conductors in parallel with
unprotected conductor should be avoided.
5. All printed-circuit board conductive loops (including
power and group loops) should be kept to a minimum.
6. The length of the transient return path to ground
should be kept to a minimum.
7. The use of shared transient return paths to a common
ground point should be avoided.
8. Ground planes should be used whenever possible.
9. For multilayer printed-circuit boards, ground vias
should be used.


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