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SN74AUP1G07DBVRE4 Datasheet(PDF) 2 Page - Texas Instruments |
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SN74AUP1G07DBVRE4 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 12 page www.ti.com DESCRIPTION/ORDERING INFORMATION (CONTINUED) A Y 2 4 SN74AUP1G07 LOW-POWER SINGLE BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS SCES591A – JULY 2004 – REVISED JULY 2005 The output of this single buffer/driver is open drain, and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION TA PACKAGE(1) ORDERABLE PART NUMBER TOP-SIDE MARKING(2) NanoStar™ – WCSP (DSBGA) SN74AUP1G07YEPR 0.23-mm Large Bump – YEP Reel of 3000 _ _ _HV_ NanoFree™ – WCSP (DSBGA) 0.23-mm Large Bump – YZP SN74AUP1G07YZPR (Pb-free) –40 °C to 85°C Reel of 3000 SN74AUP1G07DBVR SOT (SOT-23) – DBV H07_ Reel of 250 SN74AUP1G07DBVT Reel of 3000 SN74AUP1G07DCKR SOT (SC-70) – DCK HV_ Reel of 250 SN74AUP1G07DCKT (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. (2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). FUNCTION TABLE INPUT OUTPUT A Y H H L L LOGIC DIAGRAM (POSITIVE LOGIC) 2 |
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