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MAX3744 Datasheet(PDF) 9 Page - Maxim Integrated Products |
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MAX3744 Datasheet(HTML) 9 Page - Maxim Integrated Products |
9 / 10 page Layout Considerations Noise performance and bandwidth are adversely affect- ed by capacitance at the IN pad. Minimize capacitance on this pad and select a low-capacitance photodiode. Assembling the MAX3744/MAX3745 in die form using chip and wire technology provides the best possible performance. Figure 7 shows a suggested layout for a TO header for the MAX3744/MAX3745. The placement of the filter cap to minimize the ground loop of the pho- todiode is required to achieve the specified bandwidth. The OUT+ and OUT- bond wire lengths should also be minimized to meet the bandwidth specification. Special care should be taken to ensure that ESD at IN does not exceed 500V. Photodiode Filter Supply voltage noise at the cathode of the photodiode produces a current I = CPD ∆V/∆t, which reduces the receiver sensitivity (CPD is the photodiode capaci- tance.) The filter resistor of the MAX3744/MAX3745, combined with an external capacitor, can be used to reduce this noise (see the Typical Application Circuit). Current generated by supply noise voltage is divided between CFILTER and CPD. The input noise current due to supply noise is (assuming the filter capacitor is much larger than the photodiode capacitance): INOISE = (VNOISE)(CPD) / (RFILTER)(CFILTER) If the amount of tolerable noise is known, the filter capacitor can be easily selected: CFILTER = (VNOISE)(CPD) / (RFILTER)(INOISE) For example, with maximum noise voltage = 100mVP-P, CPD = 0.85pF, RFILTER = 600 Ω, and INOISE selected to be 350nA: CFILTER = (100mV)(0.85pF) / (600 Ω)(350nA) = 405pF Wire Bonding For high-current density and reliable operation, the MAX3744/MAX3745 use gold metalization. Connections to the die should be made with gold wire only, using ball- bonding techniques. Die thickness is typically 14 mils (0.4mm). 2.7Gbps SFP Transimpedance Amplifiers with RSSI _______________________________________________________________________________________ 9 PO PI PAVG TIME Figure 6. Optical Power Relations TOP VIEW OF TO-46 HEADER VCC OUT+ OUT- CASE GROUND 400pF TO 1000pF PHOTODIODE 400pF TO 1000pF MAX3744 MAX3745 Figure 7. Suggested Layout for TO-46 Header |
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