QPL9097

Ultra Low-Noise, Bypass LNA

Data Sheet August 25, 2017 | Subject to change without notice

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Mechanical Information

Package Marking and Dimensions

Notes:

1. All dimensions are in millimeters. Angles are in degrees.

2. Except where noted, this part outline conforms to JEDEC standard MO-220, Issue E (Variation VGGC) for thermally enhanced

plastic very thin fine pitch quad flat no lead package (QFN).

3. Dimension and tolerance formats conform to ASME Y14.4M-1994.

4. The terminal #1 identifier and terminal numbering conform to JESD 95-1 SPP-012.

PCB Mounting Pattern

Notes:

1. All dimensions are in millimeters. Angles are in degrees.

2. Use 1 oz. copper minimum for top and bottom layer metal.

3. Vias are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation. We recommend

a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25 mm (0.10”).

4. Ensure good package backside paddle solder attach for reliable operation and best electrical performance.

9097

Trace Code