4

LM74700-Q1

SNOSD17 – OCTOBER 2017

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Copyright © 2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

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MIN

MAX

UNIT

Input Pins

ANODE to GND

–65

65

V

CATHODE to GND

65

V

EN to GND

–65

65

V

Output Pins

GATE to ANODE

20

V

VCAP to ANODE

20

V

Input to Output Pins

ANODE to CATHODE

–75

V

–40

150

°C

6.2 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Input Pins

ANODE to GND

–60

60

V

CATHODE to GND

60

EN to GND

–60

60

Input to Output pins

ANODE to CATHODE

–70

V

–40

150

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.3 Thermal Information

LM74700-Q1

UNIT

DBV (SOT-23)

6 PINS

Junction-to-ambient thermal resistance

189.8

°C/W

Junction-to-case (top) thermal resistance

103.8

°C/W

Junction-to-board thermal resistance

45.8

°C/W

Junction-to-top characterization parameter

19.4

°C/W

Junction-to-board characterization parameter

45.5

°C/W

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.4 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

Charged device model (CDM),

per AEC Q100-011

Corner pins (VCAP, EN,

ANODE, CATHODE)

±750

Other pins

±500

6.5 Electrical Characteristics

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Shutdown Supply Current

3

15

µA