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MCP6294IDR Datasheet(PDF) 7 Page - Texas Instruments |
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MCP6294IDR Datasheet(HTML) 7 Page - Texas Instruments |
7 / 28 page 7 MCP6291, MCP6292, MCP6294 www.ti.com SBOS879A – JULY 2017 – REVISED OCTOBER 2017 Product Folder Links: MCP6291 MCP6292 MCP6294 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Input pins are diode-clamped to the power-supply rails. Current limit input signals that can swing more than 0.5 V beyond the supply rails to 10 mA or less. (3) Short-circuit to ground, one amplifier per package. 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature (unless otherwise noted) (1) MIN MAX UNIT Supply voltage 6 V Signal input pins Voltage(2) Common-mode (V–) – 0.5 (V+) + 0.5 V Differential (V+) – (V–) + 0.2 Current(2) –10 10 mA Output short-circuit(3) Continuous mA Specified, TA –40 125 °C Junction, TJ 150 Storage, Tstg –65 150 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.2 ESD Ratings over operating free-air temperature range (unless otherwise noted) VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±1500 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VS Supply voltage 2.4 5.5 V Specified temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.4 Thermal Information: MCP6292 THERMAL METRIC(1) MCP6292 UNIT D (SOIC) 8 PINS RθJA Junction-to-ambient thermal resistance 157.6 °C/W RθJC(top) Junction-to-case(top) thermal resistance 104.6 °C/W RθJB Junction-to-board thermal resistance 99.7 °C/W ψJT Junction-to-top characterization parameter 55.6 °C/W ψJB Junction-to-board characterization parameter 99.2 °C/W |
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