7

MCP6291, MCP6292, MCP6294

www.ti.com

SBOS879A – JULY 2017 – REVISED OCTOBER 2017

Product Folder Links: MCP6291 MCP6292 MCP6294

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Copyright © 2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Input pins are diode-clamped to the power-supply rails. Current limit input signals that can swing more than 0.5 V beyond the supply

rails to 10 mA or less.

(3)

Short-circuit to ground, one amplifier per package.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

6

V

Signal input pins

Common-mode

(V–) – 0.5

(V+) + 0.5

V

Differential

(V+) – (V–) + 0.2

–10

10

mA

Continuous

mA

–40

125

°C

150

–65

150

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

over operating free-air temperature range (unless otherwise noted)

VALUE

UNIT

Electrostatic discharge

±4000

V

±1500

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage

2.4

5.5

V

Specified temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information: MCP6292

MCP6292

UNIT

D (SOIC)

8 PINS

Junction-to-ambient thermal resistance

157.6

°C/W

Junction-to-case(top) thermal resistance

104.6

°C/W

Junction-to-board thermal resistance

99.7

°C/W

Junction-to-top characterization parameter

55.6

°C/W

Junction-to-board characterization parameter

99.2

°C/W