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INA2180A2IDGKR Datasheet(PDF) 5 Page - Texas Instruments |
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INA2180A2IDGKR Datasheet(HTML) 5 Page - Texas Instruments |
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5 / 38 page  5 INA180, INA2180, INA4180 www.ti.com SBOS741B – APRIL 2017 – REVISED NOVEMBER 2017 Product Folder Links: INA180 INA2180 INA4180 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) VIN+ and VIN– are the voltages at the IN+ and IN– pins, respectively. (3) Input voltage at any pin can exceed the voltage shown if the current at that pin is limited to 5 mA. 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage, VS 6 V Analog inputs, IN+, IN– (2) Differential (VIN+) – (VIN–) –26 26 V Common-mode(3) GND – 0.3 26 Output voltage GND – 0.3 VS + 0.3 V Maximum output current, IOUT 8 mA Operating free-air temperature, TA –55 150 °C Junction temperature, TJ 150 °C Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±3000 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000 7.3 Recommended Operating Conditions MIN NOM MAX UNIT VCM Common-mode input voltage (IN+ and IN–) –0.2 12 26 V VS Operating supply voltage 2.7 5 5.5 V TA Operating free-air temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.4 Thermal Information THERMAL METRIC (1) INA180 INA2180 (PREVIEW) INA4180 (PREVIEW) UNIT DBV (SOT-23) DGK (VSSOP) PW (TSSOP) 6 PINS 8 PINS 20 PINS RθJA Junction-to-ambient thermal resistance 197.1 177.9 115.9 °C/W RθJC(top) Junction-to-case (top) thermal resistance 95.8 65.6 44.3 °C/W RθJB Junction-to-board thermal resistance 53.1 99.3 59.2 °C/W ψJT Junction-to-top characterization parameter 23.4 10.5 4.7 °C/W ψJB Junction-to-board characterization parameter 52.7 97.9 58.6 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A °C/W |
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