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SN74AUP1G14

SCES578J – JUNE 2003 – REVISED SEPTEMBER 2017

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Copyright © 2003–2017, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications......................................................... 4

6.1

Absolute Maximum Ratings ...................................... 4

6.2

ESD Ratings.............................................................. 4

6.3

Recommended Operating Conditions ....................... 4

6.4

Thermal Information .................................................. 5

6.5

Electrical Characteristics........................................... 5

6.6

6.7

6.8

6.9

6.10

Operating Characteristics........................................ 8

6.11

Typical Characteristics ............................................ 9

7

Parameter Measurement Information ................ 10

7.1

(Propagation Delays, Setup and Hold Times, and

Pulse Width)............................................................. 10

7.2

(Enable and Disable Times).................................... 11

8

Detailed Description ............................................ 12

8.1

Overview ................................................................. 12

8.2

Functional Block Diagrams ..................................... 12

8.3

Feature Description................................................. 12

8.4

Device Functional Modes........................................ 13

9

Application and Implementation ........................ 14

9.1

Application Information............................................ 14

9.2

Typical Application .................................................. 14

10

Power Supply Recommendations ..................... 16

11

Layout................................................................... 16

11.1

Layout Guidelines ................................................. 16

11.2

Layout Example .................................................... 16

12

Device and Documentation Support ................. 17

12.1

Documentation Support ........................................ 17

12.2

Receiving Notification of Documentation Updates 17

12.3

Community Resources.......................................... 17

12.4

Trademarks ........................................................... 17

12.5

Electrostatic Discharge Caution ............................ 17

12.6

Glossary ................................................................ 17

13

Mechanical, Packaging, and Orderable

Information ........................................................... 17

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision I (May 2010) to Revision J

Page

•

Added DPW (X2SON) package.............................................................................................................................................. 1

•

Added Device Information table, Pin Configuration and Functions section, ESD Ratings table, Thermal Information

table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply

Recommendations section, Layout section, Device and Documentation Support section, and Mechanical,

Packaging, and Orderable Information section. ..................................................................................................................... 1

•

Deleted Ordering Information table, see Mechanical, Packaging, and Orderable Information section at the end of the

data sheet .............................................................................................................................................................................. 1

•

Changed formatting of YFP package pinout drawing ............................................................................................................ 3

•

Deleted YZP package from data sheet ................................................................................................................................. 3

•