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TLA2022IRUGT Datasheet(PDF) 4 Page - Texas Instruments |
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TLA2022IRUGT Datasheet(HTML) 4 Page - Texas Instruments |
4 / 33 page 4 TLA2021, TLA2022, TLA2024 SBAS846 – NOVEMBER 2017 www.ti.com Product Folder Links: TLA2021 TLA2022 TLA2024 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated 7 Specifications (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.1 Absolute Maximum Ratings (1) MIN MAX UNIT Power-supply voltage VDD to GND –0.3 7 V Analog input voltage AIN0, AIN1, AIN2, AIN3 GND – 0.3 VDD + 0.3 Digital input voltage SDA, SCL, ADDR GND – 0.3 7 Input current Continuous, any pin except power-supply pins –10 10 mA Temperature Junction, TJ –40 125 °C Storage, Tstg –60 125 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500 (1) AINP and AINN denote the selected positive and negative inputs. On the TLA2024, AINx denotes one of the four available analog inputs. (2) This parameter expresses the full-scale range of the ADC scaling. No more than VDD + 0.3 V or 5.5 V (whichever is smaller) must be applied to this device. See the Full-Scale Range (FSR) and LSB Size section more information. 7.3 Recommended Operating Conditions over operating ambient temperature range (unless otherwise noted) MIN NOM MAX UNIT POWER SUPPLY VDD to GND 2 5.5 V ANALOG INPUTS(1) FSR Full-scale input voltage range(2) (VIN = VAINP – VAINN) ±0.256 ±6.144 V V(AINx) Absolute input voltage GND VDD V DIGITAL INPUTS Digital input voltage GND 5.5 V TEMPERATURE TA Operating ambient temperature –40 85 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.4 Thermal Information THERMAL METRIC(1) TLA202x UNIT RUG (X2QFN) 10 PINS RθJA Junction-to-ambient thermal resistance 245.2 °C/W RθJC(top) Junction-to-case (top) thermal resistance 69.3 °C/W RθJB Junction-to-board thermal resistance 172.0 °C/W ψJT Junction-to-top characterization parameter 8.2 °C/W ψJB Junction-to-board characterization parameter 170.8 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W |
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