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TMCP1C225TRF Datasheet(PDF) 11 Page - Vishay Siliconix |
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TMCP1C225TRF Datasheet(HTML) 11 Page - Vishay Siliconix |
11 / 12 page Molded Guide www.vishay.com Vishay Polytech Revision: 11-Apr-16 7 Document Number: 40218 For technical questions, contact: tantalum@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 GUIDE TO APPLICATION 1. AC Ripple Current: the maximum allowable ripple current shall be determined from the formula: where, P = power dissipation in W at +25 °C as given in the tables in the product datasheets. RESR = the capacitor equivalent series resistance at the specified frequency. 2. AC Ripple Voltage: the maximum allowable ripple voltage shall be determined from the formula: or, from the formula: where, P = power dissipation in W at +25 °C as given in the tables in the product datasheets. RESR = The capacitor equivalent series resistance at the specified frequency. Z = The capacitor impedance at the specified frequency. 2.1 The tantalum capacitors must be used in such a condition that the sum of the working voltage and ripple voltage peak values does not exceed the rated voltage as shown in figure below. 3. Temperature Derating: power dissipation is affected by the heat sinking capability of the mounting surface. If these capacitors are to be operated at temperatures above +25 °C, the permissible ripple current (or voltage) shall be calculated using the derating coefficient as shown in the table below: 4. Reverse Voltage: the capacitors are not intended for use with reverse voltage applied. If the application of an reverse voltage is unavoidable, it must not exceed the following values: At 25 °C: 10 % of the rated voltage or 1 V, whichever is smaller. At 85 °C: 5 % of the rated voltage or 0.5 V, whichever is smaller. 5. Mounting Precautions: 5.1 Limit Pressure on Capacitor Installation with Mounter: pressure must not exceed 4.9 N with a tool end diameter of 1.5 mm when applied to the capacitors using an absorber, centering tweezers, or similar (maximum permitted pressurization time: 5 s). An excessively low absorber setting position would result in not only the application of undue force to the capacitors but capacitor and other component scattering, circuit board wiring breakage, and / or cracking as well, particularly when the capacitors are mounted together with other chips having a height of 1 mm or less. 5.2 Flux Selection 5.2.1 Select a flux that contains a minimum of chlorine and amine. 5.2.2 After flux use, the chlorine and amine in the flux remain must be removed. 5.3 Cleaning After Mounting: the following solvents are usable when cleaning the capacitors after mounting. Never use a highly active solvent. • Halogen organic solvent (HCFC225, etc.) • Alcoholic solvent (IPA, ethanol, etc.) • Petroleum solvent, alkali saponifying agent, water, etc. Circuit board cleaning must be conducted at a temperature of not higher than 50 °C and for an immersion time of not longer than 30 minutes. When an ultrasonic cleaning method is used, cleaning must be conducted at a frequency of 48 kHz or lower, at an vibrator output of 0.02 W/cm3, at a temperature of not higher than 40 °C, and for a time of 5 minutes or shorter. Notes • Care must be exercised in cleaning process so that the mounted capacitor will not come into contact with any cleaned object or the like or will not get rubbed by a stiff brush or similar. If such precautions are not taken particularly when the ultrasonic cleaning method is employed, terminal breakage may occur. • When performing ultrasonic cleaning under conditions other than stated above, conduct adequate advance checkout. MAXIMUM RIPPLE CURRENT TEMPERATURE DERATING FACTOR TEMPERATURE TMC NMC 25 °C 1.0 1.0 85 °C 0.9 0.9 105 °C 0.65 0.4 125 °C 0.4 - I RM S P R ESR ------------ = V RM S Z P R ESR ------------ = V RMS I RM S x Z = Rated voltage Ripple voltage Operating voltage Working voltage Time (s) |
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