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ABS210 Datasheet(PDF) 1 Page - Microdiode Electronics (Jiangsu) Co.,Ltd.

Part # ABS210
Description  SINGLE PHASE GLASS PASSIVATED BRIDGE RECTIFIERS
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Manufacturer  CHENDA [Microdiode Electronics (Jiangsu) Co.,Ltd.]
Direct Link  http://www.microdiode.com/en
Logo CHENDA - Microdiode Electronics (Jiangsu) Co.,Ltd.

ABS210 Datasheet(HTML) 1 Page - Microdiode Electronics (Jiangsu) Co.,Ltd.

  ABS210 Datasheet HTML 1Page - Microdiode Electronics (Jiangsu) Co.,Ltd. ABS210 Datasheet HTML 2Page - Microdiode Electronics (Jiangsu) Co.,Ltd.  
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ABS24
ABS22 THRU ABS210
SINGLE PHASE GLASS PASSIVATED BRIDGE RECTIFIERS
Voltage Range - 200 to 1000 Volts
Current - 2.0 Ampere
Case: Molded plastic body
Terminals: Plated leads solderable per MIL-STD-750,
Method 2026
Polarity: Polarity symbols marked on case
Mounting Position: Any
FEATURES
MECHANICAL DATA
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
25
200
140
200
400
280
400
600
420
600
800
560
800
1000
700
1000
ABS22
2.0
Ideal for printed circuit board
Reliable low cost construction utilizing
molded plastic technique
High temperature soldering guaranteed:
260 /10 seconds at 5 lbs., (2.3kg) tension
Small size, simple installation
High surge current capability
Ratings at 25
ambient temperature unless otherwise specified.
Single phase half-wave 60Hz,resistive or inductive load, for capacitive load derate current by 20%.
VOLTS
VOLTS
VOLTS
SYMBOLS
UNITS
Amps
Amps
Volts
VRRM
VRMS
VDC
IF(AV)
IFSM
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
On glass-epoxy P.C.B.(Note1)
On aluminum substrate(Note2)
Peak forward surge current,
8.3ms single half sine-wave superimposed on
rated load (JEDEC Method)
Maximum instantaneous forward voltage drop
per leg at 0.4A
Maximum DC reverse current
TA=25
at rated DC blocking voltage
TA=100
Typical thermal resistance(NOTE 3)
R JA
IR
VF
uA
uA
1.1
60
5.0
500
ABS
ABS26
ABS28
ABS210
-55 to +150
-55 to +150
NOTES:1.On glass epoxy P.C.B. mounted on 0.05x0.05''(1.3x1.3mm) pads
2.On aluminum substrate P.C.B. with on area of 0.8''x0.8''(20x20mm) mounted on 0.05X0.05''(1.3X1.3mm) solder pad
Operating temperature range
storage temperature range
TJ
TSTG
/W
Glass passivated chip junction
R JL
40
3.Thermal resistance form junction to ambient and junction to lead mounted on P.C.B. with 0.2X0.2''(5X5mm)
copper pads.
MDD Catalog Number


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