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ADT7311WTRZ Datasheet(PDF) 6 Page - Analog Devices |
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ADT7311WTRZ Datasheet(HTML) 6 Page - Analog Devices |
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6 / 25 page  Data Sheet ADT7311 Rev. 0 | Page 5 of 24 ABSOLUTE MAXIMUM RATINGS Table 3. Parameter Rating VDD to GND −0.3 V to +7 V DIN Input Voltage to GND −0.3 V to VDD + 0.3 V DOUT Voltage to GND −0.3 V to VDD + 0.3 V SCLK Input Voltage to GND −0.3 V to VDD + 0.3 V CS Input Voltage to GND −0.3 V to VDD + 0.3 V CT and INT Output Voltage to GND −0.3 V to VDD + 0.3 V ESD Rating (Human Body Model) 2.0 kV Operating Temperature Range1 −40°C to +150°C Storage Temperature Range −65°C to +160°C Maximum Junction Temperature, TJMAX 150°C 8-Lead SOIC_N (R-8) Power Dissipation2 WMAX = (TJMAX − TA3)/θJA Thermal Impedance4 θJA, Junction-to-Ambient (Still Air) 121°C/W θJC, Junction-to-Case 56°C/W IR Reflow Soldering 220°C Peak Temperature (RoHS-Compliant Package) 260°C (0°C) Time at Peak Temperature 20 sec to 40 sec Ramp-Up Rate 3°C/sec maximum Ramp-Down Rate −6°C/sec maximum Time from 25°C to Peak Temperature 8 minutes maximum 1 Operating at extended temperatures over prolonged periods depends on the lifetime performance of the part. Consult your local Analog Devices, Inc., account representative for more details. 2 Value relates to package being used on a standard 2-layer PCB. This gives a worst-case θJA and θJC. 3 TA = ambient temperature. 4 Junction-to-case resistance is applicable to components featuring a preferential flow direction, for example, components mounted on a heat sink. Junction-to-ambient is more useful for air-cooled, PCB-mounted components. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD CAUTION |
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