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ADT7301ARMZ-REEL7 Datasheet(PDF) 6 Page - Analog Devices |
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ADT7301ARMZ-REEL7 Datasheet(HTML) 6 Page - Analog Devices |
6 / 17 page ADT7301 Rev. B | Page 5 of 16 ABSOLUTE MAXIMUM RATINGS Table 3. Parameter Rating V DD to GND −0.3 V to +7 V Digital Input Voltage to GND −0.3 V to V DD + 0.3 V Digital Output Voltage to GND −0.3 V to V DD + 0.3 V Operating Temperature Range1 −40°C to +150°C Storage Temperature Range −65°C to +150°C Junction Temperature 150°C 6-Lead SOT-23 (RJ-6) Power Dissipation2 W MAX = (TJ max − TA 3)/θ JA Thermal Impedance θ JA, Junction-to-Ambient (Still Air) 190.4°C/W 8-Lead MSOP (RM-8) Power Dissipation2 W MAX = (TJ max − TA 3)/θ JA Thermal Impedance4 θ JA, Junction-to-Ambient (Still Air) 205.9°C/W θ JC, Junction-to-Case 43.74°C/W IR Reflow Soldering Peak Temperature 220°C (0°C/5°C) Time at Peak Temperature 10 sec to 20 sec Ramp-Up Rate 3°C/s max Ramp-Down Rate −6°C/s max Time 25°C to Peak Temperature 6 minutes max IR Reflow Soldering—Pb-Free Package Peak Temperature 260°C (0°C) Time at Peak Temperature 20 sec to 40 sec Ramp-Up Rate 3°C/s max Ramp-Down Rate −6°C/s max Time 25°C to Peak Temperature 8 minutes max 1 It is not recommended to operate the ADT7301 at temperatures above 125°C for greater than a total of 5% (5,000 hours) of the lifetime of the device. Any exposure beyond this limit affects device reliability. 2 Values relate to the package being used on a standard 2-layer PCB. Refer to Figure 3 for a plot of maximum power dissipation vs. ambient temperature (TA). 3 T A = ambient temperature. 4 Junction-to-case resistance is applicable to components featuring a preferential flow direction, for example, components mounted on a heat sink. Junction-to-ambient resistance is more useful for air-cooled, PCB-mounted components. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. TEMPERATURE ( °C) 1.2 1.0 0.8 0.6 0.4 0.2 0 SOT-23 MSOP Figure 3. Plot of Maximum Power Dissipation vs. Temperature ESD CAUTION |
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