©2017 Semiconductor Components Industries, LLC.

FOD8342, FOD8342T Rev. 1.0

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Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be

operable above the recommended operating conditions and stressing the parts to these levels is not recommended.

In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.

The absolute maximum ratings are stress ratings only.

Symbol

Parameter

Value

Unit

Storage Temperature

-40 to +125

°C

Operating Temperature

-40 to +100

°C

Junction Temperature

-40 to +125

°C

Lead Solder Temperature

(Refer to Reflow Temperature Profile)

260 for 10 sec

°C

Average Input Current

25

mA

Reverse Input Voltage

5.0

V

4

A

Supply Voltage

-0.5 to 35

V

Peak Output Voltage

V

Input Signal Rise and Fall Time

250

ns

45

mW

500

mW

Notes:

1. Maximum pulse width = 10

s

2. No derating required across operating temperature range.

3. Derate linearly from 25°C at a rate of 5.2 mW/°C.

4. Functional operation under these conditions is not implied. Permanent damage may occur if the device is subjected

to conditions outside these ratings.

Recommended Operating Conditions

The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended

operating conditions are specified to ensure optimal performance to the datasheet specifications. ON does not

recommend exceeding them or designing to absolute maximum ratings.

Symbol

Parameter

Min.

Max.

Unit

Ambient Operating Temperature

-40

+100

°C

Supply Voltage

10

30

V

Input Current (ON)

10

16

mA

Input Voltage (OFF)

-3.0

0.8

V